Inventor · disambiguated record
Hajime Iizuka
Also filed as: IIZUKA HAJIME
20 granted patents·2 pending applications·1,293 citations·filing 1990–2017
96Inventor score
Top patents by PatentIndex Score
22 records- 0198US5834844ASemiconductor device having an element with circuit pattern thereonSHINKO ELECTRIC IND CO·Filed 1996·Granted Nov 10, 1998·525 cites·10 claims
- 0297US7989707B2Chip embedded substrate and method of producing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Aug 2, 2011·71 cites·12 claims
- 0397US6472745B1Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2000·Granted Oct 29, 2002·232 cites·19 claims
- 0494US8793868B2Chip embedded substrate and method of producing the sameYAMANO TAKAHARU·Filed 2011·Granted Aug 5, 2014·14 cites·6 claims
- 0593US6380061B1Process for fabricating bump electrodeSHINKO ELECTRIC IND CO·Filed 2000·Granted Apr 30, 2002·89 cites·13 claims
- 0692US9137900B2Electronic component incorporated substrate and method for manufacturing electronic component incorporated substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted Sep 15, 2015·15 cites·12 claims
- 0791US7884484B2Wiring board and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 8, 2011·24 cites·9 claims
- 0890US9036362B2Electronic component incorporated substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted May 19, 2015·11 cites·7 claims
- 0989US5960308AProcess for making a chip sized semiconductor deviceSHINKO ELECTRIC IND CO·Filed 1998·Granted Sep 28, 1999·104 cites·11 claims
- 1088US6198169B1Semiconductor device and process for producing sameSHINKO ELECTRIC IND CO·Filed 1999·Granted Mar 6, 2001·88 cites·14 claims
- 1188US5777386ASemiconductor device and mount structure thereofSHINKO ELECTRIC IND CO·Filed 1996·Granted Jul 7, 1998·100 cites·15 claims
- 1268US8987919B2Built-in electronic component substrate and method for manufacturing the substrateSHINKO ELECTRIC IND CO·Filed 2014·Granted Mar 24, 2015·2 cites·15 claims
- 1360US7827681B2Method of manufacturing electronic component integrated substrateSHINKO ELECTRIC IND CO·Filed 2008·Granted Nov 9, 2010·2 cites·7 claims
- 1460US7587727B2Pickup deviceSANYO ELECTRIC CO·Filed 2005·Granted Sep 8, 2009·4 cites·7 claims
- 1558US10134680B2Electronic part embedded substrate and method of producing an electronic part embedded substrateSHINKO ELECTRIC IND CO·Filed 2017·Granted Nov 20, 2018·0 cites·16 claims
- 1658US9451702B2Chip embedded substrate and method of producing the sameSHINKO ELECTRIC IND CO·Filed 2014·Granted Sep 20, 2016·0 cites·19 claims
- 1757US9768122B2Electronic part embedded substrate and method of producing an electronic part embedded substrateSHINKO ELECTRIC IND CO·Filed 2016·Granted Sep 19, 2017·0 cites·19 claims
- 1856US5198942ADisc drive control device with accessing and power controlSANYO ELECTRIC CO·Filed 1990·Granted Mar 30, 1993·12 cites·2 claims
- 1944US8994134B2Electronic device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2012·Granted Mar 31, 2015·0 cites·5 claims
- 2042US8736053B2Semiconductor deviceTANAKA KOICHI·Filed 2012·Granted May 27, 2014·0 cites·10 claims
- 2141US2013135977A1Optical pickup apparatusIIZUKA HAJIME·Filed 2012·Application pending·0 cites
- 2232US2014186162A1Rotation mechanism for gas exhaust pump, manufacturing method of the same, gas exhaust pump having rotation mechanism, and manufacturing method of the sameIWAKI MASAMICHI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →