Inventor · disambiguated record
Haksoon Jung
Also filed as: JUNG HAKSOON
0 granted patents·7 pending applications·0 citations·filing 2024–2025
Top patents by PatentIndex Score
7 records- 0180US2025183514A1Antenna package including a substrate for semiconductor packaging formed based on 3dp, and an electronic device including the sameULSAN NAT INST SCIENCE & TECH UNIST·Filed 2024·Application pending·0 cites
- 0280US2025183150A1Apparatus for customized sesmicondiuctor packaging, server, system and operation method of the sameULSAN NAT INST SCIENCE & TECH UNIST·Filed 2024·Application pending·0 cites
- 0380US2025183027A1Material for producing a semiconductor packaging structure based on 3d printingULSAN NAT INST SCIENCE & TECH UNIST·Filed 2024·Application pending·0 cites
- 0480US2025183189A1Chip-let package including a substrate for sesmicondiuctor packaging formed based on 3dp, and an electronic divice including the sameULSAN NAT INST SCIENCE & TECH UNIST·Filed 2024·Application pending·0 cites
- 0580US2025185178A1Apparatus for customized sesmicondiuctor packaging, server, system and operation method of the sameULSAN NAT INST SCIENCE & TECH UNIST·Filed 2024·Application pending·0 cites
- 0680US2025183171A1Apparatus for customized sesmicondiuctor packaging, server, system and operation method of the sameULSAN NAT INST SCIENCE & TECH UNIST·Filed 2024·Application pending·0 cites
- 0768US2025393382A1Stretchable thin film transistor, stretchable panel, and electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →