Inventor · disambiguated record
Harini Kilambi
Also filed as: KILAMBI HARINI
0 granted patents·3 pending applications·0 citations·filing 2022–2023
Technology areasH10W
Files withINTEL CORP3
Top patents by PatentIndex Score
3 records- 0158US2025112168A1Hybrid bonding with embedded alignment markersINTEL CORP·Filed 2023·Application pending·0 cites
- 0253US2024113088A1Integrated circuit packages with hybrid bonded dies and methods of manufacturing the sameINTEL CORP·Filed 2022·Application pending·0 cites
- 0352US2025006678A1Packaging architecture for wafer-scale known-good-die hybrid bondingINTEL CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →