Inventor · disambiguated record
Hak Hwan Kim
Also filed as: KIM HAK HWAN
25 granted patents·13 pending applications·177 citations·filing 1999–2018
96Inventor score
Top patents by PatentIndex Score
38 records- 0198US9293675B2Semiconductor light-emitting device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 22, 2016·26 cites·22 claims
- 0298US9099631B2Semiconductor light-emitting device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 4, 2015·34 cites·50 claims
- 0394US8872205B2Semiconductor light-emitting device and method of manufacturing the sameYANG JONG-IN·Filed 2011·Granted Oct 28, 2014·9 cites·8 claims
- 0493US8975655B2Semiconductor light-emitting device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 10, 2015·6 cites·7 claims
- 0587US8536026B2Selective growth method, nitride semiconductor light emitting device and manufacturing method of the samePARK HEE SEOK·Filed 2007·Granted Sep 17, 2013·23 cites·17 claims
- 0686US8785953B2Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereofKIM HAK HWAN·Filed 2012·Granted Jul 22, 2014·10 cites·22 claims
- 0783US10038127B2Semiconductor light-emitting device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 31, 2018·2 cites·20 claims
- 0881US9871172B2Semiconductor light emitting device package with wavelength conversion layerSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 16, 2018·3 cites·11 claims
- 0981US9660163B2Semiconductor light-emitting device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 23, 2017·2 cites·19 claims
- 1081US8822249B2Light-emitting device and method of manufacturing the samePAEK HO-SUN·Filed 2012·Granted Sep 2, 2014·4 cites·10 claims
- 1181US8278671B2Led package moduleJUNG SUK HO·Filed 2012·Granted Oct 2, 2012·6 cites·6 claims
- 1280US8183583B2LED package moduleJUNG SUK HO·Filed 2009·Granted May 22, 2012·9 cites·9 claims
- 1379US8901586B2Light emitting device and method of manufacturing the sameKIM HAK HWAN·Filed 2011·Granted Dec 2, 2014·3 cites·15 claims
- 1477US10361351B2Semiconductor light emitting element package including solder bumpSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 23, 2019·3 cites·17 claims
- 1576US6269251B1Method of calculating a code value for electric power control according to temperature compensation in wireless communication terminalSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jul 31, 2001·16 cites·9 claims
- 1673US8960984B2Backlight unit including COB type light emitting diode moduleMOON KYUNG MI·Filed 2012·Granted Feb 24, 2015·2 cites·18 claims
- 1769US10147851B2Semiconductor light emitting device packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 4, 2018·1 cites·20 claims
- 1869US9153759B2Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 6, 2015·2 cites·18 claims
- 1968US9391250B2Electronic device package and package substrate for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 12, 2016·2 cites·18 claims
- 2060US2015060925A1Light emitting device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2159US8076692B2LED packageKIM HYUNG KUN·Filed 2008·Granted Dec 13, 2011·1 cites·12 claims
- 2259US2014377894A1Method of manufacturing semiconductor light emitting device packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2357US8084778B2Light emitting diode packagePAEK HO SUN·Filed 2009·Granted Dec 27, 2011·1 cites·9 claims
- 2455US2016126432A1Method of manufacturing semiconductor light emitting device packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2552US2014299898A1Light emitting device module and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2649US8344399B2LED package with wide emission range and effective heat dissipationSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jan 1, 2013·0 cites·8 claims
- 2749US2014120641A1Flip chip light emitting device package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2849US2014339581A1Method of manufacturing semiconductor light emitting device packageKWON YONG MIN·Filed 2014·Application pending·0 cites
- 2948US9716214B2Light-emitting diode packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 25, 2017·0 cites·20 claims
- 3046US2008120058A1Multi-cpu mobile terminal and multi-cpu test system and methodSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3146US2012267647A1Light emitting device module and method of manufacturing the sameKIM HAK HWAN·Filed 2012·Application pending·0 cites
- 3244US2012205697A1Flip chip light emitting device package and manufacturing method thereofKIM KWON JOONG·Filed 2012·Application pending·0 cites
- 3344US2005113152A1Method and apparatus for controlling power-off operation of mobile terminalSAMSUNG ELECTRONICS CO LTD·Filed 2004·Application pending·0 cites
- 3443US9269620B2Method of manufacturing bumpSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Feb 23, 2016·0 cites·20 claims
- 3543US6477389B1Method for compensating for transmission power deviations of channels in a mobile phoneSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Nov 5, 2002·12 cites·23 claims
- 3640US2013092962A1Light emitting device (led), manufacturing method thereof, and led module using the samePAEK HO SUN·Filed 2012·Application pending·0 cites
- 3736US2015295149A1Led package and method for manufacturing sameKIM HAK HWAN·Filed 2011·Application pending·0 cites
- 3832US2015236224A1Light emitting device package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hak Hwan Kim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →