Inventor · disambiguated record
Hag Mo Kim
Also filed as: KIM HAG MO
3 granted patents·4 pending applications·4 citations·filing 2014–2018
57Inventor score
Top patents by PatentIndex Score
7 records- 0169US9406583B2COF type semiconductor package and method of manufacturing the sameDONGBU HITEK CO LTD·Filed 2014·Granted Aug 2, 2016·3 cites·9 claims
- 0258US11355687B2Graphite-laminated chip-on-film-type semiconductor package having improved heat dissipation and electromagnetic wave shielding functionsKIM HAG MO·Filed 2018·Granted Jun 7, 2022·1 cites·15 claims
- 0343US11437556B2Graphite-laminated chip-on-film-type semiconductor package allowing improved visibility and workabilityKIM HAG MO·Filed 2018·Granted Sep 6, 2022·0 cites·16 claims
- 0440US2015325457A1Method of Packaging Semiconductor Devices and Apparatus for Performing the SameDONGBU HITEK CO LTD·Filed 2014·Application pending·0 cites
- 0540US2015303130A1Semiconductor Package and Method of Manufacturing the SameDONGBU HITEK CO LTD·Filed 2014·Application pending·0 cites
- 0640US2015325461A1Method of Packaging Semiconductor Devices and Apparatus for Performing the SameDONGBU HITEK CO LTD·Filed 2014·Application pending·0 cites
- 0740US2015311139A1Method of Packaging Semiconductor Devices and Apparatus for Performing the SameDONGBU HITEK CO LTD·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →