Inventor · disambiguated record

Haeryong Kim

Also filed as: KIM HAERYONG

40 granted patents·17 pending applications·52 citations·filing 2015–2025

96Inventor score

Technology areasH10D H10P H10B G06N H10W

Files withSAMSUNG ELECTRONICS CO LTD56 LG ELECTRONICS INC1

Top patents by PatentIndex Score

57 records

0197US10079144B2Composition for layered transition metal chalcogenide compound layer and method of forming layered transition metal chalcogenide compound layerSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 18, 2018·25 cites·21 claims
0295US10790356B2Semiconductor device including metal-2 dimensional material-semiconductor contactSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 29, 2020·7 cites·19 claims
0394US11081338B2Method of forming oxide film including two non-oxygen elements, method of manufacturing semiconductor device, method of forming dielectric film, and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 3, 2021·4 cites·20 claims
0492US11342414B2Semiconductor device including metal-2 dimensional material-semiconductor contactSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 24, 2022·2 cites·20 claims
0592US10217819B2Semiconductor device including metal-2 dimensional material-semiconductor contactSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 26, 2019·6 cites·16 claims
0688US10559660B2Semiconductor device including metal-2 dimensional material-semiconductor contactSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 11, 2020·3 cites·14 claims
0784US11018001B2Method of growing two-dimensional transition metal dichalcogenide thin film and method of manufacturing device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 25, 2021·1 cites·15 claims
0883US12513919B2Method of manufacturing metal nitride film and electronic device including metal nitride filmSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·13 claims
0983US2025098186A1Integrated circuit devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
1080US11424316B2Capacitor structure and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 23, 2022·1 cites·10 claims
1179US11810946B2Integrated circuit device including capacitor with metal nitrate interfacial layerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·20 claims
1279US11798980B2Integrated circuit device and electronic device including capacitor with interfacial layer containing metal element, other element, nitrogen, and oxygenSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
1379US9922825B2Electronics device having two-dimensional (2D) material layer and method of manufacturing the electronic device by inkjet printingSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 20, 2018·2 cites·15 claims
1478US12040360B2Semiconductor device including metal-2 dimensional material-semiconductor contactSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 16, 2024·0 cites·16 claims
1577US12132133B2Avalanche photodetectors and image sensors including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·12 claims
1675US12324145B2Semiconductor device with capping conductive layer on an electrode and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·18 claims
1775US11721781B2Avalanche photodetectors and image sensors including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 8, 2023·0 cites·18 claims
1875US10741389B2Method of growing two-dimensional transition metal dichalcogenide thin film and method of manufacturing device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 11, 2020·1 cites·16 claims
1974US12268106B2Nonvolatile memory device and operating method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·11 claims
2074US2025204290A1Nonvolatile memory device and operating method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
2172US12199137B2Integrated circuit devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·18 claims
2272US11004888B2Photoelectric conversion element and optical sensor including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 11, 2021·0 cites·16 claims
2371US11424317B2Method of manufacturing metal nitride film and electronic device including metal nitride filmSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 23, 2022·0 cites·21 claims
2471US2024030277A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
2569US11985910B2Memristor and neuromorphic device comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 14, 2024·0 cites·21 claims
2668US2025240986A1Capacitor and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
2767US11728160B2Method of forming oxide film including two non-oxygen elements, method of manufacturing semiconductor device, method of forming dielectric film, and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
2867US2025137123A1Multi-component thin film, method of manufacturing the same, and ic device including the multi-component thin filmSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
2966US11600774B2Nonvolatile memory device and operating method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 7, 2023·0 cites·11 claims
3065US11804518B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 31, 2023·0 cites·18 claims
3164US11658024B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 23, 2023·0 cites·10 claims
3264US11367799B2Broadband multi-purpose optical device and methods of manufacturing and operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 21, 2022·0 cites·20 claims
3363US2025254856A1Capacitor and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
3463US2025221007A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
3562US11665884B2Semiconductor device with capping conductive layer on an electrode and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 30, 2023·0 cites·20 claims
3661US10522583B2Photoelectric conversion element and optical sensor including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 31, 2019·0 cites·15 claims
3761US2024429267A1Capacitor and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
3861US2025234628A1Layer structure including silicide layer, method of manufacturing the same, and semiconductor devices and electronic devices including layer structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
3960US11374171B2Memristor and neuromorphic device comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 28, 2022·0 cites·22 claims
4060US10867784B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
4160US10553730B2Broadband multi-purpose optical device and methods of manufacturing and operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 4, 2020·0 cites·14 claims
4260US2025369097A1Method for selective deposition of metal layerSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
4359US11417790B2Avalanche photodetectors and image sensors including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 16, 2022·0 cites·18 claims
4458US11967502B2Methods of forming material layer, semiconductor devices, and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 23, 2024·0 cites·20 claims
4558US2024234492A1Capacitor and device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
4657US10460935B2Electronic device having two-dimensional (2D) material layer and method of manufacturing the electronic device by inkjet printingSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 29, 2019·0 cites·20 claims
4756US2024213306A1Capacitor and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
4856US2025006778A1Capacitor and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
4955US2024234031A1Semiconductor device and semiconductor apparatus and electronic apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
5055US2024213303A1Capacitor, semiconductor device including the same and electronic apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites

Showing the top 50 of 57 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →