Inventor · disambiguated record
Haruo Kojima
Also filed as: KOJIMA HARUO
20 granted patents·2 pending applications·199 citations·filing 1979–2021
93Inventor score
Top patents by PatentIndex Score
22 records- 0177US6166433AResin molded semiconductor device and method of manufacturing semiconductor packageFUJITSU LTD·Filed 1998·Granted Dec 26, 2000·59 cites·16 claims
- 0269US6023080AInput/output connection structure of a semiconductor deviceTOSHIBA KK·Filed 1998·Granted Feb 8, 2000·37 cites·22 claims
- 0366US6138833APlacer gold mining method, placer gold mining boat used in this method, placer gold digging and separating method and system therefor, and placer gold separating method and system thereforJIPANGU INC·Filed 1999·Granted Oct 31, 2000·39 cites·10 claims
- 0464US6383397B1Method for separating magnetic particles mixed in fluid, separating system, and separatorFiled 1999·Granted May 7, 2002·26 cites·7 claims
- 0556US7781259B2Method of manufacturing a semiconductor using a rigid substrateFUJITSU SEMICONDUCTOR LTD·Filed 2006·Granted Aug 24, 2010·1 cites·5 claims
- 0655US8259686B2Array antenna system and transmit/receive module thereofKANTO KAZUHIRO·Filed 2008·Granted Sep 4, 2012·4 cites·12 claims
- 0753US7009462B2Limiter circuitTOSHIBA KK·Filed 2004·Granted Mar 7, 2006·3 cites·3 claims
- 0851US8223080B2Transmission and reception moduleKOJIMA HARUO·Filed 2010·Granted Jul 17, 2012·1 cites·13 claims
- 0949US7436353B2Transmitting-receiving module of radar systemTOSHIBA KK·Filed 2006·Granted Oct 14, 2008·1 cites·8 claims
- 1049US6762493B2Microwave integrated circuitTOSHIBA KK·Filed 2003·Granted Jul 13, 2004·4 cites·16 claims
- 1147US2025003142A1Folding assistance device and folding apparatus including folding assistance deviceTOTOFOLDER MFG CO LTD·Filed 2021·Application pending·0 cites
- 1243US11252814B2Grounding structure of high frequency circuit boardTOSHIBA KK·Filed 2019·Granted Feb 15, 2022·0 cites·6 claims
- 1343US5244512AMethod for treating metal surface with zinc phosphateNIPPON PAINT CO LTD·Filed 1992·Granted Sep 14, 1993·10 cites·3 claims
- 1440US7423491B2Semiconductor amplifierTOSHIBA KK·Filed 2007·Granted Sep 9, 2008·0 cites·8 claims
- 1540US7123089B2Power amplifier with pulse differentiating circuitTOSHIBA KK·Filed 2004·Granted Oct 17, 2006·2 cites·8 claims
- 1639US4710250AMethod for producing a package for a semiconductor deviceFUJITSU LTD·Filed 1986·Granted Dec 1, 1987·10 cites·6 claims
- 1738US7372315B2Switching circuit using semiconductor switching elementTOSHIBA KK·Filed 2006·Granted May 13, 2008·0 cites·17 claims
- 1838US7262668B2Semiconductor amplifierTOSHIBA KK·Filed 2005·Granted Aug 28, 2007·0 cites·2 claims
- 1938US7122402B2Method of manufacturing a semiconductor device using a rigid substrate including the vent-end edge portion of the substrate has a thickness smaller than the other portions of the substrateFUJITSU LTD·Filed 2004·Granted Oct 17, 2006·0 cites·3 claims
- 2038US2006222061A1Transmitter-receiver moduleTOSHIBA KK·Filed 2006·Application pending·0 cites
- 2130US8581664B2Pulse electric power amplification apparatusKOJIMA HARUO·Filed 2011·Granted Nov 12, 2013·0 cites·21 claims
- 2226US4278865AGas shielded stud welding methodNIPPON STUD WELDING CO LTD·Filed 1979·Granted Jul 14, 1981·2 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →