Inventor · disambiguated record
Han-Hsin Kuo
Also filed as: KUO HAN-HSIN
13 granted patents·3 pending applications·71 citations·filing 2003–2017
87Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD7TAIWAN SEMICONDUCTOR MFG6HUANG FU-MING1KANG HUANG SOON1TSAI CHI-MING1
Top patents by PatentIndex Score
16 records- 0196US8361900B2Barrier layer for copper interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jan 29, 2013·36 cites·23 claims
- 0294US9630295B2Mechanisms for removing debris from polishing padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 25, 2017·25 cites·20 claims
- 0389US9460997B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 4, 2016·7 cites·20 claims
- 0465US9252060B2Reduction of OCD measurement noise by way of metal via slotsTSAI CHI-MING·Filed 2012·Granted Feb 2, 2016·2 cites·20 claims
- 0561US9723915B2Brush cleaning methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 8, 2017·0 cites·20 claims
- 0658US10062645B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 28, 2018·0 cites·20 claims
- 0758US8673783B2Metal conductor chemical mechanical polishKANG HUANG SOON·Filed 2010·Granted Mar 18, 2014·1 cites·14 claims
- 0857US9679848B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 13, 2017·0 cites·20 claims
- 0955US9368452B2Metal conductor chemical mechanical polishTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 14, 2016·0 cites·20 claims
- 1054US9119464B2Brush cleaning systemHUANG FU-MING·Filed 2012·Granted Sep 1, 2015·0 cites·20 claims
- 1149US9305880B2Interconnects for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 5, 2016·0 cites·19 claims
- 1245US9370854B2Method of fabricating a semiconductor device, and chemical mechanical polish toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 21, 2016·0 cites·15 claims
- 1342US2015087208A1Apparatus and method for manufacturing a semiconductor waferTAIWAN SEMICONDUCTOR MFG·Filed 2013·Application pending·0 cites
- 1440US2006112971A1Method of eliminating galvanic corrosion in copper CMPTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 1539US7091126B2Method for copper surface smoothingTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Aug 15, 2006·0 cites·20 claims
- 1638US2005170980A1ER cleaning composition and methodTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →