Inventor · disambiguated record
Hajime Kuwajima
Also filed as: KUWAJIMA HAJIME
29 granted patents·10 pending applications·302 citations·filing 1999–2025
95Inventor score
Top patents by PatentIndex Score
39 records- 0195US7855460B2Electronic component to protect an interface between a conductor and an insulator and method for manufacturing the sameTDK CORP·Filed 2008·Granted Dec 21, 2010·39 cites·4 claims
- 0292US6417026B2Acoustic wave device face-down mounted on a substrateTDK CORP·Filed 2001·Granted Jul 9, 2002·73 cites·6 claims
- 0391US6181015B1Face-down mounted surface acoustic wave deviceTDK CORP·Filed 1999·Granted Jan 30, 2001·115 cites·4 claims
- 0489US7859080B2Electronic component comprising a coil conductor and a capacity elementTDK CORP·Filed 2006·Granted Dec 28, 2010·17 cites·11 claims
- 0587US7321284B2Miniature thin-film bandpass filterTDK CORP·Filed 2006·Granted Jan 22, 2008·13 cites·24 claims
- 0683US9178264B2Directional coupler and wireless communication deviceTDK CORP·Filed 2015·Granted Nov 3, 2015·4 cites·17 claims
- 0782US7973246B2Electronic componentTDK CORP·Filed 2007·Granted Jul 5, 2011·10 cites·16 claims
- 0879US7652349B2Thin-film device and method of manufacturing sameTDK CORP·Filed 2006·Granted Jan 26, 2010·8 cites·4 claims
- 0972US2025308760A1Inductor and dc-dc converterTDK CORP·Filed 2025·Application pending·0 cites
- 1071US8048228B2Masking apparatus and method of fabricating electronic componentTDK CORP·Filed 2007·Granted Nov 1, 2011·6 cites·13 claims
- 1168US9647626B2LC composite componentTDK CORP·Filed 2015·Granted May 9, 2017·2 cites·5 claims
- 1267US7905012B2Method for manufacturing electronic componentsTDK CORP·Filed 2008·Granted Mar 15, 2011·4 cites·15 claims
- 1367US2025247001A1Inductor and dc-dc converterTDK CORP·Filed 2025·Application pending·0 cites
- 1463US7675136B2Thin-film device including a terminal electrode connected to respective end faces of conductor layersTDK CORP·Filed 2007·Granted Mar 9, 2010·2 cites·6 claims
- 1563US7589416B2Substrate, electronic component, and manufacturing method of theseTDK CORP·Filed 2006·Granted Sep 15, 2009·2 cites·6 claims
- 1662US7667951B2Electronic componentTDK CORP·Filed 2006·Granted Feb 23, 2010·2 cites·21 claims
- 1761US7649251B2Thin-film deviceTDK CORP·Filed 2007·Granted Jan 19, 2010·2 cites·5 claims
- 1860US11545303B2Electronic component and its manufacturing methodTDK CORP·Filed 2021·Granted Jan 3, 2023·0 cites·9 claims
- 1960US2025218645A1Inductor and dc-dc converterTDK CORP·Filed 2024·Application pending·0 cites
- 2059US11452209B2Electronic component and its manufacturing methodTDK CORP·Filed 2020·Granted Sep 20, 2022·0 cites·16 claims
- 2157US9300027B2Directional couplerTDK CORP·Filed 2013·Granted Mar 29, 2016·1 cites·3 claims
- 2255US11967469B2Electronic component configured to relax internal stresses due to changes in temperature and manufacturing method of the sameTDK CORP·Filed 2021·Granted Apr 23, 2024·0 cites·17 claims
- 2355US7563342B2Method of manufacturing laminated substrateTDK CORP·Filed 2006·Granted Jul 21, 2009·0 cites·6 claims
- 2454US2024331927A1Inductor and dc-dc converterTDK CORP·Filed 2024·Application pending·0 cites
- 2551US2009244809A1Thin-film device and method of manufacturing sameTDK CORP·Filed 2009·Application pending·0 cites
- 2647US2013027273A1Directional coupler and wireless communication deviceTDK CORP·Filed 2012·Application pending·0 cites
- 2747US2007097596A1Thin-film device and method of manufacturing sameTDK CORP·Filed 2006·Application pending·0 cites
- 2846US7371682B2Production method for electronic component and electronic componentTDK CORP·Filed 2004·Granted May 13, 2008·1 cites·5 claims
- 2946US2008236873A1Electronic component and method for manufacturing the sameTDK CORP·Filed 2008·Application pending·0 cites
- 3045US10426032B1Multilayer wiring structure and its manufacturing methodTDK CORP·Filed 2019·Granted Sep 24, 2019·0 cites·15 claims
- 3145US7883614B2Method of manufacturing electronic part and electronic partTDK CORP·Filed 2004·Granted Feb 8, 2011·1 cites·6 claims
- 3245US2011048789A1Electronic component and method for manufacturing the sameTDK CORP·Filed 2010·Application pending·0 cites
- 3344US7586048B2Electronic componentTDK CORP·Filed 2006·Granted Sep 8, 2009·0 cites·10 claims
- 3443US7489036B2Thin-film deviceTDK CORP·Filed 2007·Granted Feb 10, 2009·0 cites·16 claims
- 3542US7683740B2Electronic component and method for manufacturing sameTDK CORP·Filed 2007·Granted Mar 23, 2010·0 cites·11 claims
- 3642US7608881B2Thin-film device and method of manufacturing sameTDK CORP·Filed 2006·Granted Oct 27, 2009·0 cites·9 claims
- 3740US7987590B2Method for manufacturing an electronic partTDK CORP·Filed 2004·Granted Aug 2, 2011·0 cites·3 claims
- 3840US2007165359A1Thin-film device and method of manufacturing sameTDK CORP·Filed 2006·Application pending·0 cites
- 3937US8242575B2Thin-film device including a terminal electrode connected to respective end faces of conductor layersKUWAJIMA HAJIME·Filed 2010·Granted Aug 14, 2012·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →