Inventor · disambiguated record
Haksun Lee
Also filed as: LEE HAKSUN
3 granted patents·8 pending applications·8 citations·filing 2013–2024
57Inventor score
Files withKOREA ELECTRONICS TELECOMM5SAMSUNG ELECTRONICS CO LTD3ELECTRONICS & TELECOMMUNICATIONS RES INST2ELECTRONICS AND TELELCOMMUNICATIONS RES INSTITUTE1
Top patents by PatentIndex Score
11 records- 0183US9853010B2Method of fabricating a semiconductor packageELECTRONICS AND TELELCOMMUNICATIONS RES INSTITUTE·Filed 2015·Granted Dec 26, 2017·7 cites·15 claims
- 0259US9538666B2Bonding structure of electronic equipmentELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2014·Granted Jan 3, 2017·1 cites·15 claims
- 0359US2025022828A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0458US2025105127A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0558US2025149479A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0644US9006037B2Methods of forming bump and semiconductor device with the sameKOREA ELECTRONICS TELECOMM·Filed 2013·Granted Apr 14, 2015·0 cites·14 claims
- 0743US2015228617A1Semiconductor device and method of manufacturing the sameKOREA ELECTRONICS TELECOMM·Filed 2014·Application pending·0 cites
- 0841US2014367375A1Method of fabricating a solder particleKOREA ELECTRONICS TELECOMM·Filed 2013·Application pending·0 cites
- 0934US2016094258A1Transceiver module and communication apparatus including the sameKOREA ELECTRONICS TELECOMM·Filed 2015·Application pending·0 cites
- 1034US2016358892A1Semiconductor package and method for manufacturing the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2016·Application pending·0 cites
- 1132US2015364445A1Stack module package and method for manufacturing the sameKOREA ELECTRONICS TELECOMM·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →