Inventor · disambiguated record
Hak-Sun Lee
Also filed as: LEE HAK-SUN
16 granted patents·103 citations·filing 2007–2021
91Inventor score
Top patents by PatentIndex Score
16 records- 0194US7550391B2Method for forming fine patterns of a semiconductor device using double patterningSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 23, 2009·30 cites·46 claims
- 0293US7576010B2Method of forming pattern using fine pitch hard maskSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 18, 2009·19 cites·28 claims
- 0391US9190404B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 17, 2015·14 cites·15 claims
- 0490US7601647B2Method of forming fine patterns of semiconductor device using double patterningSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 13, 2009·17 cites·20 claims
- 0589US9929099B2Planarized interlayer dielectric with air gap isolationSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 27, 2018·7 cites·15 claims
- 0676US7998874B2Method for forming hard mask patterns having a fine pitch and method for forming a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 16, 2011·5 cites·12 claims
- 0775US9312181B2Semiconductor device, electronic device including the same and manufacturing methods thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 12, 2016·3 cites·20 claims
- 0870US8669622B2Non-volatile semiconductor devices and methods of manufacturing non-volatile semiconductor devicesLEE HAK-SUN·Filed 2011·Granted Mar 11, 2014·3 cites·9 claims
- 0969US8003469B2Method of manufacturing non-volatile semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Aug 23, 2011·2 cites·12 claims
- 1067US7935635B2Method of forming fine patterns of semiconductor devices using double patterningSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted May 3, 2011·2 cites·22 claims
- 1166US10600653B2Method for forming a fine patternSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 24, 2020·1 cites·20 claims
- 1261US11876017B2Integrated circuit devices including enlarged via and fully aligned metal wire and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 16, 2024·0 cites·19 claims
- 1356US11232986B2Integrated circuit devices including enlarged via and fully aligned metal wire and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 25, 2022·0 cites·18 claims
- 1450US10186485B2Planarized interlayer dielectric with air gap isolationSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 22, 2019·0 cites·20 claims
- 1545US9312478B2Magnetic devices and methods of manufacturing the sameLEE HAK-SUN·Filed 2012·Granted Apr 12, 2016·0 cites·18 claims
- 1634US8178408B2Methods of manufacturing charge trap-type non-volatile memory devicesLEE HAK-SUN·Filed 2010·Granted May 15, 2012·0 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when Hak-Sun Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →