Inventor · disambiguated record
Hakseung Lee
Also filed as: LEE HAKSEUNG
12 granted patents·2 pending applications·5 citations·filing 2019–2023
82Inventor score
Files withSAMSUNG ELECTRONICS CO LTD14
Top patents by PatentIndex Score
14 records- 0190US11380606B2Semiconductor device including via structure with head and body portionsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 5, 2022·3 cites·18 claims
- 0281US11791137B2Apparatus for etching substrate bevel and semiconductor fabrication method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 17, 2023·1 cites·15 claims
- 0379US11664316B2Semiconductor devices having penetration vias with portions having decreasing widthsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 30, 2023·1 cites·11 claims
- 0470US12300671B2Semiconductor packages and methods of manufacturing the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 0568US12347781B2Semiconductor devices having penetration viasSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·19 claims
- 0666US11798866B2Semiconductor device including via structures with undercut portions and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
- 0764US11694980B2Semiconductor stack and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 4, 2023·0 cites·9 claims
- 0863US11315894B2Semiconductor stack and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 26, 2022·0 cites·21 claims
- 0959US11810900B2Semiconductor packages stacked by wafer bonding process and methods of manufacturing the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·18 claims
- 1052US11804419B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
- 1151US11133240B2Semiconductor device and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 28, 2021·0 cites·20 claims
- 1249US11373932B2Semiconductor packages including through holes and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 28, 2022·0 cites·19 claims
- 1348US2022367321A1Semiconductor device including through electrode and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1440US2020066682A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →