Inventor · disambiguated record
Hanglim Lee
Also filed as: LEE HANGLIM
2 granted patents·4 pending applications·1 citations·filing 2019–2023
30Inventor score
Files withSEMES CO LTD6
Top patents by PatentIndex Score
6 records- 0168US11600593B2Die bonding apparatus and method and substrate bonding apparatus and methodSEMES CO LTD·Filed 2019·Granted Mar 7, 2023·1 cites·16 claims
- 0264US12387918B2Substrate processing apparatus and substrate processing methodSEMES CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
- 0353US2024105456A1Method of forming semiconductor device and substrate processing system for forming semiconductor deviceSEMES CO LTD·Filed 2023·Application pending·0 cites
- 0452US2023377894A1Method of forming semiconductor device and substrate processing system for forming semiconductor deviceSEMES CO LTD·Filed 2023·Application pending·0 cites
- 0545US2021375596A1Apparatus for treating substrateSEMES CO LTD·Filed 2021·Application pending·0 cites
- 0644US2021358720A1Substrate treating apparatusSEMES CO LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →