Inventor · disambiguated record
Haejin Lee
Also filed as: LEE HAEJIN
19 granted patents·9 pending applications·47 citations·filing 2012–2025
92Inventor score
Top patents by PatentIndex Score
28 records- 0195US11304337B2Electronic device comprising heat transfer member having metal plate and heat transfer material coupled theretoSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 12, 2022·5 cites·23 claims
- 0294US11555657B2Electronic device having heat collection/diffusion structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 17, 2023·3 cites·20 claims
- 0394US10798849B2Electronic device having heat collection/diffusion structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 6, 2020·12 cites·25 claims
- 0491US11874471B2Electronic device including heat radiating memberSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 16, 2024·4 cites·15 claims
- 0588US11047628B2Electronic device having heat collection/diffusion structureSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 29, 2021·5 cites·31 claims
- 0687US10757846B2Electronic device including shielding member connected to conductive plate covering opening of shield canSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 25, 2020·5 cites·20 claims
- 0786US11632881B2Method for controlling cooling fan and wireless charging deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 18, 2023·2 cites·19 claims
- 0884US11497141B2Heat dissipation device formed of nonmetallic material and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 8, 2022·4 cites·19 claims
- 0972US2025392660A1Electronic device including foldable displaySAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1070US11895767B2Electronic device filled with phase change material between plurality of circuit boards connected by connecting membersSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 6, 2024·1 cites·13 claims
- 1169US11098959B2Electronic device having heat collection/diffusion structureSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 24, 2021·0 cites·29 claims
- 1267US12238911B2Electronic device including sheilding structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·12 claims
- 1365US9876654B2Messaging service system and method for expanding member addition operationLEE HAEJIN·Filed 2012·Granted Jan 23, 2018·3 cites·43 claims
- 1464US12335424B2Electronic device including foldable displaySAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 1563US12317407B2Electronic device including printed circuit board structure including thermal interface materialSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 27, 2025·0 cites·18 claims
- 1663US8896375B2Efficiency improved envelope amplifier using dual switching amplifiersKOREA ADVANCED INST SCI & TECH·Filed 2013·Granted Nov 25, 2014·2 cites·12 claims
- 1763US2025240911A1Electronic device comprising structure for cooling electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1861US11503748B2Electromagnetic-wave-shielding sheet capable of dissipating heat of electronic component and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 15, 2022·0 cites·23 claims
- 1959US2025021136A1Electronic apparatus including heat dissipation sheetSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2056US9489686B2System and method based on use information obtained from a user terminalLEE HAEJIN·Filed 2012·Granted Nov 8, 2016·1 cites·8 claims
- 2155US2025107035A1Wearable device including heat dissipation structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2255US2024188218A1Circuit board module and method for manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2354US2024304565A1Electronic device including thermal interface material having phase change materialSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2453US2025338449A1Electronic device including porous heat dissipation structureSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2550US11978950B2Electronic device including noise inducing structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 7, 2024·0 cites·20 claims
- 2646US12278420B2Electronic device including mmWave antenna moduleSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 15, 2025·0 cites·20 claims
- 2744US2025220854A1Electronic device including heat dissipation memberSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2836US2013232256A1System and method for providing ranking information of mobile applicationLEE HAEJIN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →