Inventor · disambiguated record
Hanjin Lim
Also filed as: LIM HANJIN
21 granted patents·42 pending applications·45 citations·filing 2009–2025
91Inventor score
Top patents by PatentIndex Score
63 records- 0194US9673272B2Semiconductor device including capacitor and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 6, 2017·12 cites·18 claims
- 0294US9337149B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 10, 2016·16 cites·17 claims
- 0385US9305928B2Semiconductor devices having a silicon-germanium channel layer and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 5, 2016·11 cites·20 claims
- 0484US10892345B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 12, 2021·3 cites·18 claims
- 0575US11764283B2Semiconductor device including capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 19, 2023·0 cites·19 claims
- 0674US2025279262A1Batch-type apparatus for atomic layer etching (ale), and ale method and semiconductor device manufacturing method based on the same apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0773US11621339B2Semiconductor device including capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 4, 2023·0 cites·20 claims
- 0872US2024363678A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0971US2025287619A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1070US12057470B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 1170US11114541B2Semiconductor device including capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 7, 2021·0 cites·19 claims
- 1270US2024234315A9Semiconductor devices including lower electrodes including inner protective layer and outer protective layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1367US12507397B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 1467US12336202B2Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 1567US2025137123A1Multi-component thin film, method of manufacturing the same, and ic device including the multi-component thin filmSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1666US12334308B2Batch-type apparatus for atomic layer etching (ALE), and ALE method and semiconductor device manufacturing method based on the same apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·19 claims
- 1762US11978704B2Wiring structure and electronic device employing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 7, 2024·0 cites·30 claims
- 1862US9685318B2Method of forming semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 20, 2017·1 cites·17 claims
- 1961US11901291B2Semiconductor devices including lower electrodes including inner protective layer and outer protective layerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·16 claims
- 2061US2025188607A1Method of manufacturing thin filmSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2160US2024357832A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2259US2024321943A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2359US2024404947A1Semiconductor device including data storage structuresSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2458US2024389348A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2558US2025212425A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2658US2024213302A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2758US2024237332A1Semiconductor device including capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2857US2024090200A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2956US8698221B2Capacitor that includes dielectric layer structure having plural metal oxides doped with different impuritiesPARK KIYEON·Filed 2011·Granted Apr 15, 2014·2 cites·15 claims
- 3056US2024315045A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3156US2024072105A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3256US2024072106A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3356US2024096931A1Capacitor structure, method of forming the same, and semiconductor device including the capacitor structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3456US2024357801A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3555US2024021427A1Method of forming film and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3655US2024268123A1Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3755US2024292596A1Semiconductor device including capacitor and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3854US12295136B2Integrated circuit semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 6, 2025·0 cites·20 claims
- 3954US2024099017A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4054US2024105765A1Capacitor structure and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4153US2024030024A1Layer deposition method and layer deposition apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4253US2023380141A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4353US2024162281A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4453US2023413522A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4553US2023262959A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4652US2023363142A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4752US2023320075A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4852US2023290811A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4952US2023164979A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 5052US2024074150A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 63 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →