Inventor · disambiguated record
Han Wooi Lim
Also filed as: Lim Han Wooi
4 granted patents·18 citations·filing 2019–2024
73Inventor score
Technology areasH10W
Files withINTEL CORP4
Top patents by PatentIndex Score
4 records- 0195US12009298B2Fabric die to fabric die interconnect for modularized integrated circuit devicesINTEL CORP·Filed 2023·Granted Jun 11, 2024·2 cites·20 claims
- 0295US11670589B2Fabric die to fabric die interconnect for modularized integrated circuit devicesINTEL CORP·Filed 2020·Granted Jun 6, 2023·4 cites·20 claims
- 0394US10886218B2Fabric die to fabric die interconnect for modularized integrated circuit devicesINTEL CORP·Filed 2019·Granted Jan 5, 2021·12 cites·20 claims
- 0485US12394713B2Fabric die to fabric die interconnect for modularized integrated circuit devicesINTEL CORP·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →