Inventor · disambiguated record
Harvey J. Lunsman
Also filed as: LUNSMAN HARVEY · LUNSMAN HARVEY J · Lunsman Harvey John
48 granted patents·14 pending applications·229 citations·filing 2013–2025
97Inventor score
Top patents by PatentIndex Score
62 records- 0198US11157050B1Compute node tray coolingHEWLETT PACKARD ENTPR DEV LP·Filed 2020·Granted Oct 26, 2021·16 cites·20 claims
- 0297US10561040B1Flexible gasket seal for direct liquid cooling of electronic devicesHEWLETT PACKARD ENTPR DEV LP·Filed 2018·Granted Feb 11, 2020·38 cites·20 claims
- 0396US11800682B2Cooling module and a method of assembling the cooling module to an electronic circuit moduleHEWLETT PACKARD ENTPR DEV LP·Filed 2021·Granted Oct 24, 2023·4 cites·20 claims
- 0496US10582645B1Cooling apparatus for electronic componentsHEWLETT PACKARD ENTPR DEV LP·Filed 2018·Granted Mar 3, 2020·23 cites·8 claims
- 0595US10813253B2Chassis coolingHEWLETT PACKARD ENTPR DEV LP·Filed 2017·Granted Oct 20, 2020·13 cites·13 claims
- 0695US10667431B1Memory module coolingHEWLETT PACKARD ENTPR DEV LP·Filed 2019·Granted May 26, 2020·18 cites·20 claims
- 0794US12105538B2Pressure regulator assembly for a coolant distribution unitHEWLETT PACKARD ENTPR DEV LP·Filed 2022·Granted Oct 1, 2024·2 cites·20 claims
- 0894US11711907B2DisconnectsHEWLETT PACKARD ENTPR DEV LP·Filed 2020·Granted Jul 25, 2023·3 cites·19 claims
- 0993US12314095B2Fluid couplings with magnetic latch assemblyHEWLETT PACKARD ENTPR DEV LP·Filed 2023·Granted May 27, 2025·2 cites·10 claims
- 1093US10827649B2Cooling fluids in opposite directions across a deviceHEWLETT PACKARD ENTPR DEV LP·Filed 2018·Granted Nov 3, 2020·12 cites·19 claims
- 1192US10955883B1Power supply dry disconnect liquid coolingHEWLETT PACKARD ENTPR DEV LP·Filed 2019·Granted Mar 23, 2021·9 cites·28 claims
- 1292US10881030B1Electrical and liquid cooling midplaneHEWLETT PACKARD ENTPR DEV LP·Filed 2019·Granted Dec 29, 2020·14 cites·20 claims
- 1392US10750639B2Cooling memory modulesHEWLETT PACKARD ENTPR DEV LP·Filed 2018·Granted Aug 18, 2020·4 cites·20 claims
- 1492US10188016B2Node blind mate liquid coolingHEWLETT PACKARD ENTPR DEV LP·Filed 2016·Granted Jan 22, 2019·12 cites·20 claims
- 1591US10433458B1Conducting plastic cold platesHEWLETT PACKARD ENTPR DEV LP·Filed 2018·Granted Oct 1, 2019·7 cites·14 claims
- 1689US10813249B1Tunable cold platesHEWLETT PACKARD ENTPR DEV LP·Filed 2019·Granted Oct 20, 2020·6 cites·20 claims
- 1787US9128682B2Independent removable computer rack power distribution system for high-density clustered computer systemSILICON GRAPHICS INT CORP·Filed 2013·Granted Sep 8, 2015·11 cites·20 claims
- 1886US11974414B2Conforming heat transport device for dual inline memory module cooling applicationsHEWLETT PACKARD ENTPR DEV LP·Filed 2019·Granted Apr 30, 2024·3 cites·19 claims
- 1985US10893630B2Pumps with pre-charged fluidHEWLETT PACKARD ENTPR DEV LP·Filed 2018·Granted Jan 12, 2021·2 cites·17 claims
- 2085US10806056B2Cooling system for high-performance computerHEWLETT PACKARD ENTPR DEV LP·Filed 2017·Granted Oct 13, 2020·7 cites·15 claims
- 2184US11579668B2Multipoint contact conduction cooling of a removable deviceHEWLETT PACKARD ENTPR DEV LP·Filed 2020·Granted Feb 14, 2023·2 cites·20 claims
- 2284US10765032B2Floating liquid cooled heat transfer solutionHEWLETT PACKARD ENTPR DEV LP·Filed 2016·Granted Sep 1, 2020·5 cites·20 claims
- 2384US10582640B2Conducting plastic cold platesHEWLETT PACKARD ENTPR DEV LP·Filed 2018·Granted Mar 3, 2020·4 cites·18 claims
- 2483US10237999B2Configurable node expansion spaceHEWLETT PACKARD ENTPR DEV LP·Filed 2016·Granted Mar 19, 2019·5 cites·20 claims
- 2581US12432884B2Conforming heat transport device for dual inline memory module cooling applicationsHEWLETT PACKARD ENTPR DEV LP·Filed 2024·Granted Sep 30, 2025·0 cites·17 claims
- 2681US10763191B1Dual in-line memory module (DIMM) Edgewater Spring (EWS) multi point contact cooling jacketHEWLETT PACKARD ENTPR DEV LP·Filed 2019·Granted Sep 1, 2020·3 cites·20 claims
- 2781US2025024636A1Cooling module and a method of cooling an electronic circuit module using the cooling moduleHEWLETT PACKARD ENTPR DEV LP·Filed 2024·Application pending·0 cites
- 2881US2025275092A1Variable flow liquid-cooled cooling moduleHEWLETT PACKARD ENTPR DEV LP·Filed 2025·Application pending·0 cites
- 2979US2024329342A1Corrugated thermal interface device with lateral spring fingersHEWLETT PACKARD ENTPR DEV LP·Filed 2024·Application pending·0 cites
- 3078US12309969B2Receptacle with connectable spring finger for multipoint contact conduction coolingHEWLETT PACKARD ENTPR DEV LP·Filed 2023·Granted May 20, 2025·0 cites·19 claims
- 3178US11937407B2Photo-etched chassis cooling wallsHEWLETT PACKARD ENTPR DEV LP·Filed 2019·Granted Mar 19, 2024·2 cites·18 claims
- 3277US2025251763A1Fluid couplings with magnetic latch assemblyHEWLETT PACKARD ENTPR DEV LP·Filed 2025·Application pending·0 cites
- 3376US12336138B2Variable flow liquid-cooled cooling moduleHEWLETT PACKARD ENTPR DEV LP·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 3476US12245401B2DisconnectsHEWLETT PACKARD ENTPR DEV LP·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 3576US2024397667A1Elastomer embedded multipoint contact coolingHEWLETT PACKARD ENTPR DEV LP·Filed 2024·Application pending·0 cites
- 3675US11284535B2Leak mitigation in a cooling system for computing devicesHEWLETT PACKARD ENTPR DEV LP·Filed 2019·Granted Mar 22, 2022·1 cites·12 claims
- 3774US12038618B2Corrugated thermal interface device with lateral spring fingersHEWLETT PACKARD ENTPR DEV LP·Filed 2022·Granted Jul 16, 2024·0 cites·19 claims
- 3874US2025159840A1Accumulator for a chassis-level cooling systemHEWLETT PACKARD ENTPR DEV LP·Filed 2025·Application pending·0 cites
- 3972US12408303B2Elastomer embedded multipoint contact coolingHEWLETT PACKARD ENTPR DEV LP·Filed 2022·Granted Sep 2, 2025·0 cites·15 claims
- 4071US12200902B2Cooling module and a method of cooling an electronic circuit module using the cooling moduleHEWLETT PACKARD ENTPR DEV LP·Filed 2021·Granted Jan 14, 2025·0 cites·20 claims
- 4170US10888023B2Leak mitigation system for a cooling systemHEWLETT PACKARD ENTPR DEV LP·Filed 2018·Granted Jan 5, 2021·1 cites·17 claims
- 4270US2023262928A1Accumulator for a chassis-level cooling systemHEWLETT PACKARD ENTPR DEV LP·Filed 2022·Application pending·0 cites
- 4369US11729943B2Receptacle with connectable spring finger for multipoint contact conduction coolingHEWLETT PACKARD ENTPR DEV LP·Filed 2021·Granted Aug 15, 2023·0 cites·21 claims
- 4467US12207431B2System chassis with divider walls having a concave edgeHEWLETT PACKARD ENTPR DEV LP·Filed 2023·Granted Jan 21, 2025·0 cites·21 claims
- 4562US11662126B2Leak mitigation systemHEWLETT PACKARD ENTPR DEV LP·Filed 2021·Granted May 30, 2023·0 cites·20 claims
- 4660US11417451B2Magnetic blocks for thermally coupling cooling component and heat spreaderHEWLETT PACKARD ENTPR DEV LP·Filed 2020·Granted Aug 16, 2022·0 cites·18 claims
- 4759US12439564B2Lever actuated cold plateHEWLETT PACKARD ENTPR DEV LP·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 4858US12313089B2Cool fluid reservoir for a coolant distribution unitHEWLETT PACKARD ENTPR DEV LP·Filed 2022·Granted May 27, 2025·0 cites·20 claims
- 4958US11497137B2Method and apparatus for extended serial temperature control in a compute deviceHEWLETT PACKARD ENTPR DEV LP·Filed 2020·Granted Nov 8, 2022·0 cites·20 claims
- 5056US2025128923A1Lift deviceHEWLETT PACKARD ENTPR DEV LP·Filed 2023·Application pending·0 cites
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →