Inventor · disambiguated record
Hailong Luo
Also filed as: LUO HAILONG
21 granted patents·14 pending applications·11 citations·filing 2018–2024
90Inventor score
Files withNINGBO SEMICONDUCTOR INT CORP30NINGBO SEMICONDUCTOR INT CORPORATION SHANGHAI BRANCH4UNIV TOWN HOSPITAL OF CHONGQING MEDICAL UNIV1
Top patents by PatentIndex Score
35 records- 0196US11870410B2Packaging method and packaging structure of film bulk acoustic resonatorNINGBO SEMICONDUCTOR INT CORP·Filed 2021·Granted Jan 9, 2024·4 cites·14 claims
- 0278US10790211B2Wafer-level packaging method and package structure thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Sep 29, 2020·2 cites·12 claims
- 0376US10804177B2Wafer-level packaging method and package structure thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Oct 13, 2020·2 cites·20 claims
- 0475US2024313738A1Packaging structure of film bulk acoustic resonatorNINGBO SEMICONDUCTOR INT CORP·Filed 2024·Application pending·0 cites
- 0574US10861822B2Wafer-level packaging method and package structure thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Dec 8, 2020·1 cites·13 claims
- 0672US2024106406A1Packaging structure of film bulk acoustic resonatorNINGBO SEMICONDUCTOR INT CORP·Filed 2023·Application pending·0 cites
- 0769US10910286B2Wafer-level system-in-package packaging method and package structure thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Feb 2, 2021·1 cites·20 claims
- 0869US10756051B2Wafer-level system packaging method and package structureNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Aug 25, 2020·1 cites·20 claims
- 0966US11764245B2Fabrication method of photodetector and imaging sensorNINGBO SEMICONDUCTOR INT CORP·Filed 2021·Granted Sep 19, 2023·0 cites·15 claims
- 1065US11309279B2Package structure of wafer-level system-in-packageNINGBO SEMICONDUCTOR INT CORP·Filed 2020·Granted Apr 19, 2022·0 cites·5 claims
- 1164US11562980B2Wafer-level package structureNINGBO SEMICONDUCTOR INT CORP·Filed 2020·Granted Jan 24, 2023·0 cites·7 claims
- 1264US11450582B2Wafer-level package structureNINGBO SEMICONDUCTOR INT CORP·Filed 2020·Granted Sep 20, 2022·0 cites·10 claims
- 1364US11101311B2Photodetector and fabrication method, and imaging sensorNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Aug 24, 2021·0 cites·11 claims
- 1463US12028043B2Packaging method and packaging structure of FBARNINGBO SEMICONDUCTOR INT CORP·Filed 2021·Granted Jul 2, 2024·0 cites·16 claims
- 1559US12009803B2Bulk acoustic wave resonator, filter and radio frequency communication systemNINGBO SEMICONDUCTOR INT CORP·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 1658US11444244B2Mask plate and fabrication method thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Sep 13, 2022·0 cites·5 claims
- 1755US2023336157A1Mems device and fabrication method thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2023·Application pending·0 cites
- 1855US2023336149A1Mems device and fabrication method thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2023·Application pending·0 cites
- 1954US12057820B2Thin film piezoelectric acoustic wave resonator and manufacturing method therefor, and filterNINGBO SEMICONDUCTOR INT CORP·Filed 2020·Granted Aug 6, 2024·0 cites·20 claims
- 2054US2023198498A1Thin-film bulk acoustic wave resonator, forming method, and filterNINGBO SEMICONDUCTOR INT CORP·Filed 2023·Application pending·0 cites
- 2153US10861821B2Packaging method and package structure of wafer-level system-in-packageNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Dec 8, 2020·0 cites·11 claims
- 2252US12224730B2Manufacturing method of a composite substrate of an acoustic wave resonatorNINGBO SEMICONDUCTOR INT CORP·Filed 2020·Granted Feb 11, 2025·0 cites·12 claims
- 2352US2023006644A1Film bulk acoustic resonator and fabrication method thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2022·Application pending·0 cites
- 2452US2023024466A1Film piezoelectric acoustic resonator, filter and electronic apparatusNINGBO SEMICONDUCTOR INT CORP·Filed 2022·Application pending·0 cites
- 2551US2022368310A1Film piezoelectric acoustic wave filter and fabrication method thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2022·Application pending·0 cites
- 2650US2022352870A1Composite substrate, surface acoustic wave resonator, and fabricating methods thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2022·Application pending·0 cites
- 2747US12081191B2Packaging method of a film bulk acoustic resonatorNINGBO SEMICONDUCTOR INT CORPORATION SHANGHAI BRANCH·Filed 2021·Granted Sep 3, 2024·0 cites·14 claims
- 2847US10978421B2Wafer-level packaging method and package structureNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Apr 13, 2021·0 cites·20 claims
- 2947US10784229B2Wafer level package structure and wafer level packaging methodNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Sep 22, 2020·0 cites·20 claims
- 3046US12506458B2Packaging module and packaging method of BAW resonatorNINGBO SEMICONDUCTOR INT CORPORATION SHANGHAI BRANCH·Filed 2021·Granted Dec 23, 2025·0 cites·16 claims
- 3146US2024122464A1Single-operator laparoscope auxiliary operating deviceUNIV TOWN HOSPITAL OF CHONGQING MEDICAL UNIV·Filed 2023·Application pending·0 cites
- 3244US2022321093A1Thin film piezoelectric acoustic wave resonator and manufacturing method therefor, and filterNINGBO SEMICONDUCTOR INT CORP·Filed 2020·Application pending·0 cites
- 3344US2023353118A1Film bulk acoustic resonator and fabrication method thereofNINGBO SEMICONDUCTOR INT CORPORATION SHANGHAI BRANCH·Filed 2020·Application pending·0 cites
- 3441US2019341265A1Mask and fabrication method thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Application pending·0 cites
- 3539US2022231651A1Method for forming film bulk acoustic resonatorNINGBO SEMICONDUCTOR INT CORPORATION SHANGHAI BRANCH·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →