Inventor · disambiguated record
Haruo Mishina
Also filed as: MATSUBARA KATSUMI · MISHINA HARUO
23 granted patents·1,003 citations·filing 1975–1996
97Inventor score
Top patents by PatentIndex Score
23 records- 0196US4105372AFluid rotary machineHITACHI LTD·Filed 1976·Granted Aug 8, 1978·142 cites·21 claims
- 0292US4174196AScrew fluid machineHITACHI LTD·Filed 1977·Granted Nov 13, 1979·46 cites·14 claims
- 0392US4125345ATurbo-fluid deviceHITACHI LTD·Filed 1975·Granted Nov 14, 1978·76 cites·6 claims
- 0490US5558015AHot press with pressure vessels to uniformly distribute pressure to the work pieceHITACHI TECHNO ENG·Filed 1994·Granted Sep 24, 1996·76 cites·10 claims
- 0588US5932012APaste applicator having positioning meansHITACHI TECHNO ENG·Filed 1996·Granted Aug 3, 1999·113 cites·6 claims
- 0687US4231706AImpeller of a centrifugal blowerHITACHI LTD·Filed 1978·Granted Nov 4, 1980·41 cites·3 claims
- 0783US5415693APaste applicatorHITACHI TECHNO ENG·Filed 1993·Granted May 16, 1995·46 cites·6 claims
- 0881US5437727AApparatus for drawing paste pattern on substrateHITACHI TECHNO ENG·Filed 1992·Granted Aug 1, 1995·43 cites·5 claims
- 0980US5716207AHeating furnaceHITACHI TECHNO ENG·Filed 1996·Granted Feb 10, 1998·78 cites·20 claims
- 1075US5038496AVapor reflow type soldering apparatusHITACHI TECHNO ENG·Filed 1989·Granted Aug 13, 1991·29 cites·11 claims
- 1174US5197384AScreen printerHITACHI TECHNO ENG·Filed 1991·Granted Mar 30, 1993·40 cites·19 claims
- 1274US4996781AVapor reflow type soldering apparatus with an improved flux separating unitHITACHI TECHNO ENG·Filed 1989·Granted Mar 5, 1991·30 cites·11 claims
- 1373US5467912AReflow soldering apparatus for soldering electronic parts to circuit substrateHITACHI TECHNO ENG·Filed 1993·Granted Nov 21, 1995·33 cites·8 claims
- 1473US5333774AVapor reflow soldering apparatusHITACHI TECHNO ENG·Filed 1993·Granted Aug 2, 1994·28 cites·4 claims
- 1572US5163599AReflow soldering apparatusHITACHI TECHNO ENG·Filed 1990·Granted Nov 17, 1992·30 cites·10 claims
- 1668US5614024AApparatus for applying pasteHITACHI TECHNO ENG·Filed 1994·Granted Mar 25, 1997·33 cites·10 claims
- 1768US5358166AReflow soldering apparatusHITACHI TECHNO ENG·Filed 1993·Granted Oct 25, 1994·25 cites·11 claims
- 1865US4735001AVapor reflow type soldering apparatusHITACHI TECHNO ENG·Filed 1987·Granted Apr 5, 1988·23 cites·20 claims
- 1959US5156325AVapor reflow type soldering method and apparatus thereforHITACHI TECHNO ENG·Filed 1990·Granted Oct 20, 1992·19 cites·12 claims
- 2055US5203487AReflow soldering method and system thereforHITACHI TECHNO ENG·Filed 1992·Granted Apr 20, 1993·17 cites·8 claims
- 2155US4776105AApparatus for fixing electronic parts to printed circuit boardHITACHI TECHNO ENG·Filed 1986·Granted Oct 11, 1988·13 cites·9 claims
- 2248US5146694AVapor reflow type soldering apparatusHITACHI TECHNO ENG·Filed 1990·Granted Sep 15, 1992·12 cites·4 claims
- 2347US4809443AApparatus for fixing electronic parts to printed circuit boardHITACHI TECHNO ENG·Filed 1986·Granted Mar 7, 1989·10 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →