Inventor · disambiguated record
Habib N. Najm
Also filed as: NAJM HABIB · NAJM HABIB N
11 granted patents·1,192 citations·filing 1990–1997
94Inventor score
Files withTEXAS INSTRUMENTS INC11
Top patents by PatentIndex Score
11 records- 0197US5305417AApparatus and method for determining wafer temperature using pyrometryTEXAS INSTRUMENTS INC·Filed 1993·Granted Apr 19, 1994·510 cites·23 claims
- 0295US5156461AMulti-point pyrometry with real-time surface emissivity compensationTEXAS INSTRUMENTS INC·Filed 1991·Granted Oct 20, 1992·156 cites·19 claims
- 0390US5317656AFiber optic network for multi-point emissivity-compensated semiconductor wafer pyrometryTEXAS INSTRUMENTS INC·Filed 1993·Granted May 31, 1994·97 cites·33 claims
- 0490US5255286AMulti-point pyrometry with real-time surface emissivity compensationTEXAS INSTRUMENTS INC·Filed 1992·Granted Oct 19, 1993·97 cites·30 claims
- 0588US5265957AWireless temperature calibration device and methodTEXAS INSTRUMENTS INC·Filed 1992·Granted Nov 30, 1993·73 cites·38 claims
- 0686US5508934AMulti-point semiconductor wafer fabrication process temperature control systemTEXAS INSTRUMENTS INC·Filed 1994·Granted Apr 16, 1996·71 cites·66 claims
- 0782US5345534ASemiconductor wafer heater with infrared lamp module with light blocking meansTEXAS INSTRUMENTS INC·Filed 1993·Granted Sep 6, 1994·80 cites·10 claims
- 0878US5435379AMethod and apparatus for low-temperature semiconductor processingTEXAS INSTRUMENTS INC·Filed 1992·Granted Jul 25, 1995·66 cites·45 claims
- 0967US5326170AWireless temperature calibration device and methodTEXAS INSTRUMENTS INC·Filed 1993·Granted Jul 5, 1994·26 cites·17 claims
- 1038US5139288ACoupling device for providing electrical and thermal insulation under high pressure, cryogenic conditionsTEXAS INSTRUMENTS INC·Filed 1990·Granted Aug 18, 1992·10 cites·8 claims
- 1135US6122041ALiquid cooled light pipe assembly for pyrometric temperature measurementTEXAS INSTRUMENTS INC·Filed 1997·Granted Sep 19, 2000·6 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →