Inventor · disambiguated record
Hayato Nakano
Also filed as: NAKANO HAYATO
18 granted patents·6 pending applications·24 citations·filing 2006–2024
89Inventor score
Top patents by PatentIndex Score
24 records- 0189US10784214B2Semiconductor module, electric automobile and power control unitFUJI ELECTRIC CO LTD·Filed 2019·Granted Sep 22, 2020·7 cites·19 claims
- 0288US10163868B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Dec 25, 2018·7 cites·16 claims
- 0384US9595958B1Semiconductor device and driving method for the sameFUJI ELECTRIC CO LTD·Filed 2016·Granted Mar 14, 2017·6 cites·8 claims
- 0478US9324847B2Semiconductor device and semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2013·Granted Apr 26, 2016·3 cites·8 claims
- 0572US12362331B2Semiconductor device and manufacturing method thereofFUJI ELECTRIC CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·10 claims
- 0662US11855049B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·24 claims
- 0762US2025167099A1Semiconductor device and method for manufacturing thereofFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 0860US2024363507A1Semiconductor device, semiconductor module, and lead frameFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 0957US2024120249A1Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 1055US2023223441A1Semiconductor device and semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 1154US7281827B2Vehicle headlight apparatusTOYOTA MOTOR CO LTD·Filed 2006·Granted Oct 16, 2007·1 cites·7 claims
- 1253US11315867B2External connection part of semiconductor module, semiconductor module, external connection terminal, and manufacturing method of external connection terminal of semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2020·Granted Apr 26, 2022·0 cites·14 claims
- 1353US9818852B2Semiconductor device and semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2016·Granted Nov 14, 2017·0 cites·11 claims
- 1453US9812561B2Semiconductor device manufacturing method, including substrate thinning and ion implantingFUJI ELECTRIC CO LTD·Filed 2016·Granted Nov 7, 2017·0 cites·6 claims
- 1553US2023124426A1Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
- 1652US11380608B2Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2021·Granted Jul 5, 2022·0 cites·15 claims
- 1751US11069621B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2019·Granted Jul 20, 2021·0 cites·12 claims
- 1849US11996374B2External connector of semiconductor module, method for manufacturing external connector of semiconductor module, semiconductor module, vehicle, and method for connecting external connector to bus barFUJI ELECTRIC CO LTD·Filed 2020·Granted May 28, 2024·0 cites·14 claims
- 1947US11322436B2Semiconductor module and method of manufacturing the sameFUJI ELECTRIC CO LTD·Filed 2020·Granted May 3, 2022·0 cites·9 claims
- 2044US10966322B2Semiconductor device and manufacturing method of semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2019·Granted Mar 30, 2021·0 cites·20 claims
- 2143US9773936B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Sep 26, 2017·0 cites·4 claims
- 2242US10741550B2Reverse-conducting insulated gate bipolar transistorFUJI ELECTRIC CO LTD·Filed 2019·Granted Aug 11, 2020·0 cites·6 claims
- 2338US10170395B2Semiconductor device and a manufacturing method of the semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Granted Jan 1, 2019·0 cites·17 claims
- 2429US2018174987A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →