Inventor · disambiguated record
Haris Khan Niazi
Also filed as: NIAZI HARIS KHAN
0 granted patents·8 pending applications·0 citations·filing 2022–2024
Top patents by PatentIndex Score
8 records- 0151US2024063091A1Thermally enhanced structural member and/or bond layer for multichip composite devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 0251US2024347501A1Methods and apparatus for die-shape modification bondingNIAZI HARIS KHAN·Filed 2024·Application pending·0 cites
- 0351US2024063136A1Integrated circuit device with electrically active fiducialsINTEL CORP·Filed 2022·Application pending·0 cites
- 0450US2024061194A1Photonic quasi-monolithic die architecturesINTEL CORP·Filed 2022·Application pending·0 cites
- 0550US2024063089A1Thermal management of base dies in multichip composite devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 0650US2024063147A1Device, method, and system to protect through-dielectric vias of a composite chipletINTEL CORP·Filed 2022·Application pending·0 cites
- 0748US2024063142A1Die crack mitigation in multi-chip composite ic structuresINTEL CORP·Filed 2022·Application pending·0 cites
- 0847US2024006332A1Fiducial marks for verifying alignment accuracy of bonded integrated circuit diesINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →