Inventor · disambiguated record
Han Teo Park
Also filed as: PARK HAN TEO
9 granted patents·10 pending applications·2 citations·filing 2016–2024
74Inventor score
Top patents by PatentIndex Score
19 records- 0179US10077381B2Polishing slurry compositionK C TECH CO LTD·Filed 2016·Granted Sep 18, 2018·2 cites·13 claims
- 0267US12441911B2Composition for semiconductor processing and polishing method of semiconductor device using the sameSK ENPULSE CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·16 claims
- 0359US12480021B2Composition for semiconductor process, method for preparing the same and method for preparing semiconductor device using the sameSK ENPULSE CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·13 claims
- 0459US12116503B2Polishing composition for semiconductor process and method for manufacturing semiconductor device by using the sameSK ENPULSE CO LTD·Filed 2022·Granted Oct 15, 2024·0 cites·19 claims
- 0559US2025136842A1Polishing composition for semiconductor process and method of manufacturing substrate using sameSK ENPULSE CO LTD·Filed 2024·Application pending·0 cites
- 0658US12444611B2Semiconductor process polishing composition and polishing method of substrate applied with polishing compositionSK ENPULSE CO LTD·Filed 2021·Granted Oct 14, 2025·0 cites·13 claims
- 0757US2024274439A1Polishing composition for semiconductor process and method for polishing a substrate using the sameSK ENPULSE CO LTD·Filed 2024·Application pending·0 cites
- 0857US2025115787A1Polishing composition for semiconductor process and polishing method of substrate using the sameSK ENPULSE CO LTD·Filed 2024·Application pending·0 cites
- 0952US2024218251A1Polishing composition for semiconductor processing and method of polishing a substrateSK ENPULSE CO LTD·Filed 2024·Application pending·0 cites
- 1052US2023407135A1Composition for semiconductor processing and method of fabricating semiconductor device using the sameSK ENPULSE CO LTD·Filed 2023·Application pending·0 cites
- 1149US12486428B2Polishing pad and method for manufacturing semiconductor device using sameSK ENPULSE CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·13 claims
- 1248US12110421B2Composition for semiconductor processing and method of fabricating semiconductor device using the sameSK ENPULSE CO LTD·Filed 2022·Granted Oct 8, 2024·0 cites·13 claims
- 1348US2022325139A1Polishing composition for semiconductor process and method for manufacturing semiconductor device by using the sameSKC SOLMICS CO LTD·Filed 2022·Application pending·0 cites
- 1447US12444616B2Polishing composition for semiconductor processing polishing composition preparation method, and semiconductor device manufacturing method to which polishing composition is appliedSK ENPULSE CO LTD·Filed 2021·Granted Oct 14, 2025·0 cites·10 claims
- 1546US2023332014A1Polishing compostion for semiconductor process, manufacturing method of polishing composition and method for manufacturing semiconductor device by using the sameSK ENPULSE CO LTD·Filed 2021·Application pending·0 cites
- 1646US2024043718A1Polishing composition for semiconductor processing,method for preparing polishing composition, and method for manufacturing semiconductor element to which polishing composition is appliedSK ENPULSE CO LTD·Filed 2021·Application pending·0 cites
- 1745US2024043719A1Polishing composition for semiconductor processing,method for preparing polishing composition, and method for manufacturing semiconductor element to which polishing composition is appliedSKC ENPULSE CO LTD·Filed 2021·Application pending·0 cites
- 1841US2020157382A1Slurry composition for polishing tungsten barrier layerKCTECH CO LTD·Filed 2017·Application pending·0 cites
- 1929US9994735B2Slurry composition for polishing tungstenK C TECH CO LTD·Filed 2016·Granted Jun 12, 2018·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →