Inventor · disambiguated record
Han-Ping Pu
Also filed as: PU HAN-PING
138 granted patents·24 pending applications·2,957 citations·filing 1999–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD73SILICONWARE PRECISION INDUSTRIES CO LTD59TAIWAN SEMICONDUCTOR MFG9CHEN YU-FENG4PU HAN-PING4
Top patents by PatentIndex Score
162 records- 0199US6828665B2Module device of stacked semiconductor packages and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Dec 7, 2004·249 cites·14 claims
- 0298US8759964B2Wafer level package structure and fabrication methodsPU HAN-PING·Filed 2007·Granted Jun 24, 2014·584 cites·18 claims
- 0398US7932601B2Enhanced copper posts for wafer level chip scale packagingTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Apr 26, 2011·59 cites·20 claims
- 0497US11824005B2Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 21, 2023·2 cites·20 claims
- 0597US10490479B1Packaging of semiconductor device with antenna and heat spreaderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 26, 2019·16 cites·20 claims
- 0697US6787918B1Substrate structure of flip chip packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Sep 7, 2004·135 cites·13 claims
- 0797US6593662B1Stacked-die package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jul 15, 2003·203 cites·26 claims
- 0896US7772685B2Stacked semiconductor structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Aug 10, 2010·44 cites·8 claims
- 0995US10825773B2Package structure with reinforcement structures in a redistribution circuit structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 3, 2020·8 cites·20 claims
- 1095US8288871B1Reduced-stress bump-on-trace (BOT) structuresSHIEH YUH CHERN·Filed 2011·Granted Oct 16, 2012·53 cites·20 claims
- 1195US7102239B2Chip carrier for semiconductor chipSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Sep 5, 2006·98 cites·8 claims
- 1295US6184573B1Chip packagingSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Feb 6, 2001·179 cites·11 claims
- 1394US11929319B2Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·20 claims
- 1494US11424197B2Package, package structure with redistributing circuits and antenna elements and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 23, 2022·8 cites·20 claims
- 1594US10529698B2Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 7, 2020·9 cites·20 claims
- 1694US7208825B2Stacked semiconductor packagesSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Apr 24, 2007·35 cites·4 claims
- 1794US6570249B1Semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted May 27, 2003·84 cites·8 claims
- 1894US6291264B1Flip-chip package structure and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Sep 18, 2001·88 cites·6 claims
- 1993US11437327B2Integrated fan-out packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 6, 2022·2 cites·20 claims
- 2093US10366966B1Method of manufacturing integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 30, 2019·8 cites·20 claims
- 2193US7638879B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Dec 29, 2009·26 cites·9 claims
- 2293US7274088B2Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Sep 25, 2007·69 cites·8 claims
- 2393US7247934B2Multi-chip semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Jul 24, 2007·52 cites·6 claims
- 2492US11342269B2Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·2 cites·20 claims
- 2592US10629540B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 21, 2020·6 cites·20 claims
- 2692US9553065B2Bumps for chip scale packaging including under bump metal structures with different diametersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 24, 2017·12 cites·18 claims
- 2792US9502383B23D integrated circuit package processing with panel type lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 22, 2016·10 cites·17 claims
- 2891US11705409B2Semiconductor device having antenna on chip package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 18, 2023·2 cites·20 claims
- 2991US7820543B2Enhanced copper posts for wafer level chip scale packagingTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Oct 26, 2010·18 cites·10 claims
- 3091US2025343136A1Conductive Traces in Semiconductor Devices and Methods of Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3190US11189603B2Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 30, 2021·5 cites·20 claims
- 3290US9502360B2Stress compensation layer for 3D packagingLIN CHUN-HUNG·Filed 2012·Granted Nov 22, 2016·12 cites·20 claims
- 3390US9159686B2Crack stopper on under-bump metallization layerCHEN YU-FENG·Filed 2012·Granted Oct 13, 2015·11 cites·20 claims
- 3490US7855443B2Stack structure of semiconductor packages and method for fabricating the stack structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Dec 21, 2010·19 cites·4 claims
- 3590US7199459B2Semiconductor package without bonding wires and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Apr 3, 2007·21 cites·5 claims
- 3690US6400036B1Flip-chip package structure and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Jun 4, 2002·53 cites·5 claims
- 3789US11335666B2Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·2 cites·16 claims
- 3889US6459144B1Flip chip semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Oct 1, 2002·69 cites·19 claims
- 3989US6350669B1Method of bonding ball grid array package to circuit board without causing package collapseSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Feb 26, 2002·43 cites·17 claims
- 4088US9978656B2Mechanisms for forming fine-pitch copper bump structuresLIN TSUNG SHU·Filed 2012·Granted May 22, 2018·12 cites·20 claims
- 4188US7671466B2Semiconductor package having heat dissipating device with cooling fluidSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Mar 2, 2010·14 cites·9 claims
- 4288US6849942B2Semiconductor package with heat sink attached to substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Feb 1, 2005·48 cites·11 claims
- 4387US8058100B2Method for fabricating chip scale package structure with metal pads exposed from an encapsulantPU HAN-PING·Filed 2010·Granted Nov 15, 2011·8 cites·14 claims
- 4487US7489044B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Feb 10, 2009·12 cites·11 claims
- 4587US7196414B2Semiconductor package with heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Mar 27, 2007·12 cites·6 claims
- 4687US6891273B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted May 10, 2005·44 cites·11 claims
- 4786US12451426B2Conductive traces in semiconductor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 21, 2025·0 cites·19 claims
- 4886US10510693B2Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·4 cites·20 claims
- 4986US9780046B2Seal rings structures in semiconductor device interconnect layers and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 3, 2017·5 cites·20 claims
- 5086US7759170B2Fabrication method of semiconductor package having heat dissipation deviceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2010·Granted Jul 20, 2010·7 cites·14 claims
Showing the top 50 of 162 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →