Inventor · disambiguated record
Hansung Ryu
Also filed as: RYU HANSUNG
10 granted patents·9 pending applications·73 citations·filing 2014–2024
86Inventor score
Files withSAMSUNG ELECTRONICS CO LTD19
Top patents by PatentIndex Score
19 records- 0197US10211070B2Semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 19, 2019·51 cites·18 claims
- 0287US9978694B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 22, 2018·12 cites·17 claims
- 0382US10937771B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 2, 2021·3 cites·17 claims
- 0481US10347611B2Semiconductor packages having redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 9, 2019·4 cites·19 claims
- 0580US10699915B2Semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 30, 2020·2 cites·20 claims
- 0671US11574819B2Semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 7, 2023·0 cites·20 claims
- 0769US10937667B2Semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 2, 2021·0 cites·20 claims
- 0862US9640575B2Semiconductor package including image sensor and holder with transparent cover and adhesive stopperSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 2, 2017·1 cites·3 claims
- 0958US2024172371A1Semiconductor packages and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1054US2024105657A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1153US2025157962A1Semiconductor package including dummy pads and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1252US2025132227A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1352US2025022812A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1452US2025132274A1Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1552US2025151293A1High bandwidth memorySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1651US9324748B2Semiconductor package including an image sensor and a holder with stoppersSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 26, 2016·0 cites·11 claims
- 1747US2024063077A1Semiconductor package with reinforcing structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1846US12272610B2Semiconductor package with stiffenerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 8, 2025·0 cites·18 claims
- 1931US2016379937A1Substrate stripSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →