Inventor · disambiguated record
Hajime Saiki
Also filed as: SAIKI HAJIME
35 granted patents·8 pending applications·449 citations·filing 1997–2012
97Inventor score
Top patents by PatentIndex Score
43 records- 0196US7808799B2Wiring boardNGK SPARK PLUG CO·Filed 2007·Granted Oct 5, 2010·73 cites·23 claims
- 0289US7488896B2Wiring board with semiconductor componentNGK SPARK PLUG CO·Filed 2005·Granted Feb 10, 2009·23 cites·8 claims
- 0388US7122894B2Wiring substrate and process for manufacturing the sameNGK SPARK PLUG CO·Filed 2005·Granted Oct 17, 2006·19 cites·9 claims
- 0486US6080936AConnecting board with oval-shaped protrusionsNGK SPARK PLUG CO·Filed 1997·Granted Jun 27, 2000·57 cites·4 claims
- 0582US6518518B1Resin substrateNGK SPARK PLUG CO·Filed 2000·Granted Feb 11, 2003·28 cites·9 claims
- 0681US6376782B1Resinous circuit board with pins improved in joining strengthNGK SPARK PLUG CO·Filed 2000·Granted Apr 23, 2002·32 cites·20 claims
- 0778US6648211B2Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pinNGK SPARK PLUG CO·Filed 2001·Granted Nov 18, 2003·14 cites·31 claims
- 0875US7704548B2Method for manufacturing wiring boardNGK SPARK PLUG CO·Filed 2007·Granted Apr 27, 2010·6 cites·12 claims
- 0973US6148900AConnecting board for connection between base plate and mounting boardNGK SPARK PLUG CO·Filed 1998·Granted Nov 21, 2000·31 cites·14 claims
- 1071US7164085B2Multilayer wiring board including stacked via structureNGK SPARK PLUG CO·Filed 2004·Granted Jan 16, 2007·15 cites·3 claims
- 1168US8143534B2Wiring board having solder bump and method for manufacturing the sameHANDO TAKUYA·Filed 2009·Granted Mar 27, 2012·5 cites·4 claims
- 1268US6583366B2Substrate having pinsNGK SPARK PLUG CO·Filed 2001·Granted Jun 24, 2003·15 cites·9 claims
- 1367US6660946B2Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pinNGK SPARK PLUG CO·Filed 2001·Granted Dec 9, 2003·14 cites·31 claims
- 1465US8319111B2Wiring board having wiring laminate portion with via conductors embedded in resin insulating layersSAIKI HAJIME·Filed 2007·Granted Nov 27, 2012·5 cites·24 claims
- 1564US5859407AConnecting board for connection between base plate and mounting boardNGK SPARK PLUG CO·Filed 1997·Granted Jan 12, 1999·30 cites·17 claims
- 1661US6555757B2Pin solder jointed to a resin substrate, made having a predetermined hardness and dimensionsNGK SPARK PLUG CO·Filed 2001·Granted Apr 29, 2003·10 cites·6 claims
- 1761US6018197AWired board with improved bonding padsNGK SPARK PLUG CO·Filed 1997·Granted Jan 25, 2000·25 cites·6 claims
- 1860US8937256B2Method for manufacturing wiring board for mounting electronic component, wiring board for mounting electronic component, and method for manufacturing wiring board having an electronic componentINOUE MASAHIRO·Filed 2012·Granted Jan 20, 2015·1 cites·4 claims
- 1960US8322596B2Wiring substrate manufacturing methodHAYASHI TAKAHIRO·Filed 2011·Granted Dec 4, 2012·1 cites·4 claims
- 2060US7692103B2Wiring substrate and manufacturing process of the sameNGK SPARK PLUG CO·Filed 2004·Granted Apr 6, 2010·8 cites·9 claims
- 2159US9132494B2Wiring board and method for manufacturing the sameINOUE MASAHIRO·Filed 2012·Granted Sep 15, 2015·1 cites·1 claims
- 2252US7202156B2Process for manufacturing a wiring substrateNGK SPARK PLUG CO·Filed 2004·Granted Apr 10, 2007·4 cites·6 claims
- 2350US7420131B2Wiring substrateNGK SPARK PLUG CO·Filed 2004·Granted Sep 2, 2008·7 cites·4 claims
- 2450US7291791B2Resin substrateNGK SPARK PLUG CO·Filed 2004·Granted Nov 6, 2007·3 cites·10 claims
- 2549US6960729B2Upright-pin-joined resin substrate, method of producing the substrate, pins, and method of producing the pinsNGK SPARK PLUG CO·Filed 2002·Granted Nov 1, 2005·5 cites·10 claims
- 2647US6115913AConnecting boardNGK SPARK PLUG CO·Filed 1999·Granted Sep 12, 2000·12 cites·10 claims
- 2747US2013161079A1Multi-layer wiring substrate and manufacturing method thereofNGK SPARK PLUG CO·Filed 2012·Application pending·0 cites
- 2846US9006580B2Method of manufacturing multilayer wiring substrate, and multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2012·Granted Apr 14, 2015·0 cites·10 claims
- 2946US7317165B2Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substrateNGK SPARK PLUG CO·Filed 2004·Granted Jan 8, 2008·1 cites·14 claims
- 3046US2013111746A1Method of manufacturing multilayer wiring substrateNGK SPARK PLUG CO·Filed 2012·Application pending·0 cites
- 3143US9237656B2Method of manufacturing multi-layer wiring boardNGK SPARK PLUG CO·Filed 2012·Granted Jan 12, 2016·0 cites·3 claims
- 3241US8866025B2Multilayer wiring boardINOUE MASAHIRO·Filed 2012·Granted Oct 21, 2014·0 cites·4 claims
- 3340USD423532SSolder column interposerNGK SPARK PLUG CO·Filed 1998·Granted Apr 25, 2000·3 cites·1 claims
- 3440US2005102831A1Process for manufacturing a wiring substrateFiled 2004·Application pending·0 cites
- 3540US2005102830A1Process for manufacturing a wiring substrateFiled 2004·Application pending·0 cites
- 3639US9119333B2Multilayer wiring boardHANDO TAKUYA·Filed 2012·Granted Aug 25, 2015·0 cites·3 claims
- 3739US2003089524A1Resin substrateNGK SPARK PLUG CO·Filed 2002·Application pending·0 cites
- 3839US2012043371A1Wiring substrate manufacturing methodHAYASHI TAKAHIRO·Filed 2011·Application pending·0 cites
- 3939US2012111616A1Electronic-component-mounted wiring substrate and method of manufacturing the sameINOUE MASAHIRO·Filed 2011·Application pending·0 cites
- 4035US6978714B2Solder paste printing method, solder paste printing apparatus, and method for manufacturing a wiring substrate having solder- printed layersNGK SPARK PLUG CO·Filed 2003·Granted Dec 27, 2005·0 cites·15 claims
- 4133USD423027SSolder ball interposerNGK SPARK PLUG CO·Filed 1998·Granted Apr 18, 2000·1 cites·1 claims
- 4232US2004182265A1Wiring substrateNGK SPARK PLUG CO·Filed 2004·Application pending·0 cites
- 4331USD423533SSolder ball interposerNGK SPARK PLUG CO·Filed 1998·Granted Apr 25, 2000·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →