Inventor · disambiguated record
Habib Saridikmen
Also filed as: SARIDIKMEN HABIB
5 granted patents·8 pending applications·6 citations·filing 2010–2023
67Inventor score
Top patents by PatentIndex Score
13 records- 0165US2023055459A1Striking tool for use in a high speed comminution millELEMENT SIX UK LTD·Filed 2022·Application pending·0 cites
- 0262US10024112B2Superhard cutterNILEN ROGER WILLIAM·Filed 2011·Granted Jul 17, 2018·3 cites·17 claims
- 0360US2020238292A1Striking tool for use in a high speed comminution millELEMENT SIX UK LTD·Filed 2018·Application pending·0 cites
- 0456US11391148B2Cutting assemblyELEMENT SIX UK LTD·Filed 2019·Granted Jul 19, 2022·1 cites·11 claims
- 0556US8973686B2Super-hard cutter inserts and toolsDOLAN GERALD·Filed 2010·Granted Mar 10, 2015·2 cites·18 claims
- 0650US2025347224A1Method of mining using a disc cutterELEMENT SIX UK LTD·Filed 2023·Application pending·0 cites
- 0749US10221629B2Polycrystalline super hard construction and a method for making sameELEMENT SIX LTD·Filed 2013·Granted Mar 5, 2019·0 cites·21 claims
- 0847US2024247588A1Method of mining a rock formation using a disc cutter and a rock breaker toolELEMENT SIX UK LTD·Filed 2022·Application pending·0 cites
- 0940US2015259987A1Polycrystalline super hard construction and a method for making sameELEMENT SIX ABRASIVES SA·Filed 2013·Application pending·0 cites
- 1039US9067305B2Polycrystalline diamondSARIDIKMEN HABIB·Filed 2011·Granted Jun 30, 2015·0 cites·8 claims
- 1139US2015284827A1Polycrystalline super hard construction and a method for making sameCAN NEDRET·Filed 2013·Application pending·0 cites
- 1235US2021032988A1Cutting assemblyELEMENT SIX UK LTD·Filed 2019·Application pending·0 cites
- 1335US2021003006A1Cutting assemblyELEMENT SIX UK LTD·Filed 2019·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Habib Saridikmen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →