Inventor · disambiguated record
Hayato Sawamoto
Also filed as: SAWAMOTO Hayato
2 granted patents·6 pending applications·2 citations·filing 2018–2024
35Inventor score
Top patents by PatentIndex Score
8 records- 0182US12103999B2Photosensitive resin composition, photosensitive resin film, printed wiring board, semiconductor package, and method for producing printed wiring boardSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Oct 1, 2024·2 cites·19 claims
- 0252US2025362600A1Photosensitive resin composition, photosensitive element, printed wiring board, and method for manufacturing printed wiring boardRESONAC CORP·Filed 2024·Application pending·0 cites
- 0347US12498636B2Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring boardSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Dec 16, 2025·0 cites·19 claims
- 0445US2020391287A1Compound powderHITACHI CHEMICAL CO LTD·Filed 2018·Application pending·0 cites
- 0545US2024160103A1Photosensitive resin composition, photosensitive element, printed wiring board, and method for manufacturing printed wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 0643US2023221638A1Photosensitive resin composition, dry film, printed wiring board, and method for producing printed wiring boardSHOWA DENKO MATERIALS CO LTD·Filed 2020·Application pending·0 cites
- 0742US2024337934A1Photosensitive resin composition, photosensitive element, printed wiring board, and method for producing printed wiring boardRESONAC CORP·Filed 2021·Application pending·0 cites
- 0839US2022155681A1Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and method for producing multilayer printed wiring boardSHOWA DENKO MATERIALS CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →