Inventor · disambiguated record
Han Kyun Shin
Also filed as: SHIN HAN KYUN
1 granted patent·3 pending applications·0 citations·filing 2022–2024
2Inventor score
Technology areasC25D
Files withUNIV DONG A RES FOUND FOR IND ACAD COOP4
Top patents by PatentIndex Score
4 records- 0164US2025129501A1Copper foil with high elongation rate and method of manufacturing sameUNIV DONG A RES FOUND FOR IND ACAD COOP·Filed 2024·Application pending·0 cites
- 0262US2024254650A1Electroplating apparatus for surface modification of pipesUNIV DONG A RES FOUND FOR IND ACAD COOP·Filed 2023·Application pending·0 cites
- 0361US2024093401A1Method of manufacturing multilayer metal plate by electroplating and multilayer metal plate manufactured therebyUNIV DONG A RES FOUND FOR IND ACAD COOP·Filed 2023·Application pending·0 cites
- 0451US12351928B2Electrodeposition apparatus to prepare a multilayer copper foilUNIV DONG A RES FOUND FOR IND ACAD COOP·Filed 2022·Granted Jul 8, 2025·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →