Inventor · disambiguated record
Hae-Jeong Sohn
Also filed as: SOHN HAE-JEONG
7 granted patents·48 citations·filing 2002–2006
85Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0190US7453159B2Semiconductor chip having bond padsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 18, 2008·14 cites·24 claims
- 0286US7576440B2Semiconductor chip having bond pads and multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 18, 2009·9 cites·20 claims
- 0379US7541682B2Semiconductor chip having bond padsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 2, 2009·5 cites·14 claims
- 0476US7547977B2Semiconductor chip having bond padsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 16, 2009·4 cites·14 claims
- 0576US6642627B2Semiconductor chip having bond pads and multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 4, 2003·14 cites·28 claims
- 0652US7825523B2Semiconductor chip having bond padsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 2, 2010·0 cites·24 claims
- 0749US7148578B2Semiconductor multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Dec 12, 2006·2 cites·28 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →