Inventor · disambiguated record
Hans-Joachim Trumpp
Also filed as: TRUMPP HANS J · TRUMPP HANS-JOACHIM
11 granted patents·823 citations·filing 1983–1991
93Inventor score
Files withIBM11
Top patents by PatentIndex Score
11 records- 0198US4502914AMethod of making structures with dimensions in the sub-micrometer rangeIBM·Filed 1983·Granted Mar 5, 1985·428 cites·22 claims
- 0287US4589952AMethod of making trenches with substantially vertical sidewalls in silicon through reactive ion etchingIBM·Filed 1984·Granted May 20, 1986·70 cites·8 claims
- 0386US4642163AMethod of making adhesive metal layers on substrates of synthetic material and device produced therebyIBM·Filed 1983·Granted Feb 10, 1987·37 cites·8 claims
- 0483US4869781AMethod for fabricating a semiconductor integrated circuit structure having a submicrometer length device elementIBM·Filed 1988·Granted Sep 26, 1989·74 cites·27 claims
- 0579US5109267AMethod for producing an integrated circuit structure with a dense multilayer metallization patternIBM·Filed 1991·Granted Apr 28, 1992·73 cites·19 claims
- 0677US4513203AMask and system for mutually aligning objects in ray exposure systemsIBM·Filed 1984·Granted Apr 23, 1985·19 cites·23 claims
- 0776US4556628AProcess for producing printed circuit boards with metallic conductor structures embedded in the insulating substrateIBM·Filed 1984·Granted Dec 3, 1985·32 cites·8 claims
- 0867US4816115AProcess of making via holes in a double-layer insulationIBM·Filed 1988·Granted Mar 28, 1989·41 cites·17 claims
- 0960US4980317AMethod of producing integrated semiconductor structures comprising field-effect transistors with channel lengths in the submicron range using a three-layer resist systemIBM·Filed 1989·Granted Dec 25, 1990·20 cites·18 claims
- 1057US5055383AProcess for making masks with structures in the submicron rangeIBM·Filed 1989·Granted Oct 8, 1991·24 cites·14 claims
- 1143US4857383ASynthetic substrate with adhesive metal layerIBM·Filed 1987·Granted Aug 15, 1989·5 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →