Inventor · disambiguated record
Hanlung Tsai
Also filed as: TSAI HANLUNG
3 granted patents·0 citations·filing 2021–2022
43Inventor score
Technology areasH10W
Files withSJ SEMICONDUCTOR JIANGYIN CORP3
Top patents by PatentIndex Score
3 records- 0165US11842976B2Semiconductor package structure with heat sink and method preparing the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2022·Granted Dec 12, 2023·0 cites·5 claims
- 0257US11488925B2Semiconductor package structure with heat sink and method preparing the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Nov 1, 2022·0 cites·9 claims
- 0344US12132036B2Fan-out LED packaging structure and methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Oct 29, 2024·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →