Inventor · disambiguated record
Hao-Yi Tsai
Also filed as: TSAI HAO-YI
427 granted patents·95 pending applications·1,717 citations·filing 2001–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD427TAIWAN SEMICONDUCTOR MFG50CHEN HSIEN-WEI9JENG SHIN-PUU7YU CHEN-HUA7
Top patents by PatentIndex Score
522 records- 0199US10269773B1Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·45 cites·20 claims
- 0299US9881850B2Package structures and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 30, 2018·56 cites·20 claims
- 0399US9275925B2System and method for an improved interconnect structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 1, 2016·64 cites·20 claims
- 0498US12132024B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 29, 2024·4 cites·20 claims
- 0598US12113022B2Semiconductor package and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 8, 2024·6 cites·20 claims
- 0698US11848300B2Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·4 cites·20 claims
- 0798US11508656B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 22, 2022·8 cites·20 claims
- 0898US11502013B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 15, 2022·4 cites·20 claims
- 0998US11410932B2Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·5 cites·20 claims
- 1098US11139249B2Semiconductor devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 5, 2021·6 cites·20 claims
- 1198US10128213B2Integrated fan-out stacked package with fan-out redistribution layer (RDL)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 13, 2018·16 cites·20 claims
- 1297US11809000B2Photonic integrated circuit and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 7, 2023·4 cites·20 claims
- 1397US11798925B2IPD modules with flexible connection scheme in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 24, 2023·3 cites·20 claims
- 1497US11682655B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 20, 2023·3 cites·20 claims
- 1597US11664325B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 30, 2023·3 cites·20 claims
- 1697US11515268B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 29, 2022·4 cites·20 claims
- 1797US11424213B2Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 23, 2022·4 cites·20 claims
- 1897US11251141B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
- 1997US11244906B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 8, 2022·5 cites·15 claims
- 2097US11201118B2Chip package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 14, 2021·4 cites·20 claims
- 2197US11158576B2Package structure having redistribution layer structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 26, 2021·4 cites·20 claims
- 2297US10049953B2Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·15 cites·20 claims
- 2397US9917072B2Method of manufacturing an integrated stacked package with a fan-out redistribution layer (RDL) and a same encapsulating processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 13, 2018·15 cites·20 claims
- 2497US9691708B1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 27, 2017·26 cites·20 claims
- 2597US8476770B2Apparatus and methods for forming through viasSHAO TUNG-LIANG·Filed 2011·Granted Jul 2, 2013·58 cites·14 claims
- 2697US8373254B2Structure for reducing integrated circuit corner peelingTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Feb 12, 2013·76 cites·20 claims
- 2797US7235424B2Method and apparatus for enhanced CMP planarization using surrounded dummy designTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jun 26, 2007·150 cites·16 claims
- 2896US11848319B2Multi-chip semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·2 cites·20 claims
- 2996US11749640B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·2 cites·20 claims
- 3096US11694966B2Chip package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 4, 2023·2 cites·20 claims
- 3196US11506843B1Semiconductor device having photonic and electronic dies and an optical fiber assembly creating an air gapTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 22, 2022·5 cites·20 claims
- 3296US11251119B2Package structure, package-on-package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
- 3396US10510713B1Semicondcutor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·12 cites·20 claims
- 3496US9761522B2Wireless charging package with chip integrated in coil centerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 12, 2017·19 cites·20 claims
- 3596US9640498B1Integrated fan-out (InFO) package structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 2, 2017·20 cites·20 claims
- 3695US12368141B2IPD modules with flexible connection scheme in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 22, 2025·1 cites·19 claims
- 3795US11848288B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 19, 2023·2 cites·20 claims
- 3895US11682626B2Chamfered die of semiconductor package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 20, 2023·3 cites·20 claims
- 3995US11614592B2Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 28, 2023·3 cites·20 claims
- 4095US11004803B2Dummy dies for reducing warpage in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·11 cites·20 claims
- 4195US11004786B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·10 cites·20 claims
- 4295US10832985B2Sensor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 10, 2020·12 cites·20 claims
- 4395US10658258B1Chip package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 19, 2020·8 cites·20 claims
- 4495US9589941B1Multi-chip package system and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 7, 2017·10 cites·20 claims
- 4595US8405211B2Bump pad structureTSAI HAO-YI·Filed 2010·Granted Mar 26, 2013·23 cites·20 claims
- 4695US8125052B2Seal ring structure with improved cracking protectionJENG SHIN-PUU·Filed 2007·Granted Feb 28, 2012·42 cites·18 claims
- 4795US8058151B2Methods of die sawingJENG SHIN-PUU·Filed 2010·Granted Nov 15, 2011·18 cites·11 claims
- 4895US7754601B2Semiconductor interconnect air gap formation processTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Jul 13, 2010·40 cites·7 claims
- 4994US12009281B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 11, 2024·2 cites·20 claims
- 5094US11929318B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·20 claims
Showing the top 50 of 522 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Hao-Yi Tsai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →