Inventor · disambiguated record
Hajime Tsuda
Also filed as: TSUDA HAJIME
5 granted patents·8 pending applications·11 citations·filing 2002–2021
71Inventor score
Top patents by PatentIndex Score
13 records- 0174US7898636B2Clay thin film substrate, clay thin film substrate with electrode, and display device using the sameTOMOEGAWA CO LTD·Filed 2006·Granted Mar 1, 2011·5 cites·17 claims
- 0264US8197741B2Method for producing clay thin filmTSUDA HAJIME·Filed 2006·Granted Jun 12, 2012·2 cites·7 claims
- 0363US6942756B2Fluororesin fiber paper, copper-clad laminate for printed board using the same and production process thereofTOMOEGAWA PAPER CO LTD·Filed 2002·Granted Sep 13, 2005·4 cites·7 claims
- 0459US2014158277A1Clay film compositeTOMOEGAWA CO LTD·Filed 2014·Application pending·0 cites
- 0555US12354839B2Radio-frequency antenna and plasma processing deviceEMD CORP·Filed 2021·Granted Jul 8, 2025·0 cites·17 claims
- 0652US10988876B2Cushion paperTOMOEGAWA CO LTD·Filed 2018·Granted Apr 27, 2021·0 cites·7 claims
- 0750US2009120326A1Clay dispersion, method for manufacturing the same and clay thin filmTOMOEGAWA CO LTD·Filed 2008·Application pending·0 cites
- 0849US2013253214A1Clay dispersion, method for manufacturing the same and clay thin filmTOMOEGAWA CO LTD·Filed 2013·Application pending·0 cites
- 0946US2019257014A1Copper fiber nonwoven fabricTOMOEGAWA CO LTD·Filed 2017·Application pending·0 cites
- 1045US2012308761A1Clay film compositeTSUDA HAJIME·Filed 2010·Application pending·0 cites
- 1143US2009233083A1Thin film and thin film laminate comprising the sameTOMOEGAWA CO LTD·Filed 2007·Application pending·0 cites
- 1231US2012091668A1Heat-resistant seal memberMOTEGI KATSUMI·Filed 2010·Application pending·0 cites
- 1330US2012145038A1Clay dispersion liquid, and method for producing the same, clay film, and method for producing the same, and transparent materialTSUDA HAJIME·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →