Inventor · disambiguated record

Harshadrai Vora

Also filed as: VORA HARSHADRAI

2 granted patents·191 citations·filing 1987–1990

70Inventor score

Technology areasH10W

Files withUNISYS CORP2

Top patents by PatentIndex Score

2 records

0190US5019943AHigh density chip stack having a zigzag-shaped face which accommodates connections between chipsUNISYS CORP·Filed 1990·Granted May 28, 1991·159 cites·17 claims
0261US4721831AModule for packaging and electrically interconnecting integrated circuit chips on a porous substrate, and method of fabricating sameUNISYS CORP·Filed 1987·Granted Jan 26, 1988·32 cites·12 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →