Inventor · disambiguated record
Haidong Wei
Also filed as: WEI HAIDONG
2 granted patents·1 citations·filing 2010–2024
29Inventor score
Top patents by PatentIndex Score
2 records- 0149US9349615B2SiP system-integration IC chip package and manufacturing method thereofXIE JIANYOU·Filed 2010·Granted May 24, 2016·1 cites·4 claims
- 0247US12466954B2Preparation method for air-permeable and antibacterial silicone rubber material and application thereof in home textilesDONGGUAN JINLV NEW MAT CO LTD·Filed 2024·Granted Nov 11, 2025·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →