Inventor · disambiguated record
Harald Wiesbauer
Also filed as: WIESBAUER HARALD
5 granted patents·9 citations·filing 2010–2019
68Inventor score
Top patents by PatentIndex Score
5 records- 0190US10468286B2Method for the bonding and debonding of substratesEV GROUP E THALLNER GMBH·Filed 2016·Granted Nov 5, 2019·8 cites·6 claims
- 0273US11024530B2Method for the bonding and debonding of substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jun 1, 2021·1 cites·7 claims
- 0346US9245869B2Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elementsEV GROUP E THALLNER GMBH·Filed 2013·Granted Jan 26, 2016·0 cites·21 claims
- 0440US9362154B2Method for treatment of a temporarily bonded product waferBURGGRAF JÜRGEN·Filed 2010·Granted Jun 7, 2016·0 cites·15 claims
- 0535US9224630B2Method for producing a wafer provided with chipsBURGGRAF JÜRGEN·Filed 2010·Granted Dec 29, 2015·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →