Inventor · disambiguated record
Han-Wei Wu
Also filed as: WU HAN-WEI
20 granted patents·7 pending applications·41 citations·filing 2013–2025
91Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD25JIANGYU KANGJIAN INNOVATION MEDICAL TECH CHENGDU CO LTD1TAIWAN SEMICONDUCTOR MFG1
Top patents by PatentIndex Score
27 records- 0196US9034723B1Method of making a FinFET deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 19, 2015·28 cites·20 claims
- 0290US11961738B2Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·2 cites·20 claims
- 0385US11804410B2Thin-film non-uniform stress evaluationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 31, 2023·2 cites·20 claims
- 0481US12362180B2Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 0581US2025308893A1Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0679US2025323101A1Thin-film non-uniform stress evaluationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0778US9443768B2Method of making a FinFET deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 13, 2016·2 cites·20 claims
- 0877US10644134B2Gate formation with varying work function layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 5, 2020·2 cites·20 claims
- 0976US10872889B2Semiconductor component and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 22, 2020·2 cites·20 claims
- 1075US10488766B2Lithography system having invisible pellicle over maskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 26, 2019·1 cites·20 claims
- 1174US10115796B2Method of pulling-back sidewall metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 30, 2018·2 cites·20 claims
- 1273US12374588B2Method for evaluating non-uniform stressTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 1372US11387105B2Loading effect reduction through multiple coat-etch processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·0 cites·20 claims
- 1471US2024389353A1Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1570US11830936B2Gate formation with varying work function layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
- 1666US2024023339A1Memory structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1765US11239345B2Gate formation with varying work function layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 1, 2022·0 cites·20 claims
- 1864US12120886B2Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 15, 2024·0 cites·20 claims
- 1964US10755936B2Loading effect reduction through multiple coat-etch processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 25, 2020·0 cites·20 claims
- 2062US11749570B2Etch monitoring and performingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 2160US2025124694A1Method for training model for recognizing medical image, method for recognizing medical image, and electronic deviceJIANGYU KANGJIAN INNOVATION MEDICAL TECH CHENGDU CO LTD·Filed 2024·Application pending·0 cites
- 2259US11996297B2Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 2359US11844224B2Memory structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 12, 2023·0 cites·20 claims
- 2459US10276392B2Loading effect reduction through multiple coat-etch processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·0 cites·20 claims
- 2556US9711604B1Loading effect reduction through multiple coat-etch processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 18, 2017·0 cites·15 claims
- 2656US2023139799A1Pattern formation method and manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2753US2024105518A1Method for forming semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →