Inventor · disambiguated record
Hai Xia
Also filed as: XIA HAI · XIA HAI-YING
13 granted patents·1 pending application·5 citations·filing 2001–2022
82Inventor score
Files withSHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD7HUAWEI TECH CO LTD4HONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD1LI JINCHUN1
Top patents by PatentIndex Score
14 records- 0174US10651717B2Six-degree-of-freedom linear motorSHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD·Filed 2015·Granted May 12, 2020·2 cites·8 claims
- 0266US10658327B1Chip bonding apparatus and bonding methodSHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD·Filed 2017·Granted May 19, 2020·1 cites·11 claims
- 0365US10748800B2Chip bonding apparatus and methodSHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO LTD·Filed 2017·Granted Aug 18, 2020·1 cites·17 claims
- 0459US10223183B2Rapid fault detection method and deviceHUAWEI TECH CO LTD·Filed 2016·Granted Mar 5, 2019·1 cites·6 claims
- 0551US12423126B2Pod deployment method and apparatusHUAWEI TECH CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·18 claims
- 0645US9575032B2Method of analyzing at least two inhibitors simultaneously in a plating bathHONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD·Filed 2014·Granted Feb 21, 2017·0 cites·8 claims
- 0745US2003027298A1Enzymatic array and process of making sameFiled 2001·Application pending·0 cites
- 0842US10824477B2Network function virtualization service container creationHUAWEI TECH CO LTD·Filed 2018·Granted Nov 3, 2020·0 cites·20 claims
- 0941US10763235B2Batch bonding apparatus and bonding methodSHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD·Filed 2017·Granted Sep 1, 2020·0 cites·12 claims
- 1040US11037900B2Chip bonding device and bonding method thereofSHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD·Filed 2017·Granted Jun 15, 2021·0 cites·19 claims
- 1138US10770320B2Universal chip batch-bonding apparatus and methodSHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD·Filed 2017·Granted Sep 8, 2020·0 cites·12 claims
- 1237US11081380B2Chip bonding deviceSHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD·Filed 2018·Granted Aug 3, 2021·0 cites·18 claims
- 1337US10768960B2Method for affinity binding of interrupt of virtual network interface card, and computer deviceHUAWEI TECH CO LTD·Filed 2016·Granted Sep 8, 2020·0 cites·7 claims
- 1433US8920031B2Split type aerostatic bearingLI JINCHUN·Filed 2012·Granted Dec 30, 2014·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →