Inventor · disambiguated record
Haiyong Xu
Also filed as: XU HAIYONG
0 granted patents·4 pending applications·0 citations·filing 2014–2018
Technology areasH10W
Files withQUALCOMM INC4
Top patents by PatentIndex Score
4 records- 0147US2019043817A1Land grid based multi size pad packageQUALCOMM INC·Filed 2018·Application pending·0 cites
- 0243US2018053740A1Land grid based multi size pad packageQUALCOMM INC·Filed 2016·Application pending·0 cites
- 0340US2015364438A1Balanced current distribution structure for large current deliveryQUALCOMM INC·Filed 2014·Application pending·0 cites
- 0432US2017373032A1Redistribution layer (rdl) fan-out wafer level packaging (fowlp) structureQUALCOMM INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →