Inventor · disambiguated record
Han-Wei Yang
Also filed as: Yang han-wei
17 granted patents·19 citations·filing 2013–2019
90Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD17
Top patents by PatentIndex Score
17 records- 0190US9349688B2Systems and methods to enhance passivation integrityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 24, 2016·5 cites·20 claims
- 0290US9076804B2Systems and methods to enhance passivation integrityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 7, 2015·7 cites·20 claims
- 0381US9070687B2Semiconductor device with self-protecting fuseTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 30, 2015·4 cites·20 claims
- 0470US9761486B2Method of chip packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 12, 2017·3 cites·20 claims
- 0566US10777480B2Systems and methods to enhance passivation integrityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 15, 2020·0 cites·20 claims
- 0664US10515866B2Systems and methods to enhance passivation integrityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·0 cites·20 claims
- 0759US10157810B2Systems and methods to enhance passivation integrityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·0 cites·20 claims
- 0858US9773716B2Systems and methods to enhance passivation integrityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 26, 2017·0 cites·20 claims
- 0957US10204843B2Interconnect arrangement with stress-reducing structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 12, 2019·0 cites·20 claims
- 1055US10014251B2Semiconductor device with self-protecting fuse and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 3, 2018·0 cites·20 claims
- 1155US9818666B2Interconnect arrangement with stress-reducing structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 14, 2017·0 cites·20 claims
- 1255US9252047B2Interconnect arrangement with stress-reducing structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 2, 2016·0 cites·20 claims
- 1353US9472508B2Interconnect arrangement with stress-reducing structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 18, 2016·0 cites·20 claims
- 1452US9299658B2Semiconductor device with self-protecting fuse and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 29, 2016·0 cites·20 claims
- 1551US9093373B2Conductive diffusion barrier structure for ohmic contactsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 28, 2015·0 cites·20 claims
- 1647US9299621B2Smart measurement techniques to enhance inline process control stabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 29, 2016·0 cites·20 claims
- 1746US9406559B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 2, 2016·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Han-Wei Yang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →