Inventor · disambiguated record
Ha Young Yim
Also filed as: YIM HA-YOUNG
2 granted patents·1 pending application·22 citations·filing 2009–2011
60Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0185US8362621B2Microelectronic devices including multiple through-silicon via structures on a conductive pad and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jan 29, 2013·14 cites·30 claims
- 0271US8129840B2Semiconductor package and methods of manufacturing the sameJO CHAJEA·Filed 2009·Granted Mar 6, 2012·8 cites·19 claims
- 0335US2012129333A1Method for manufacturing semiconductor package and semiconductor package manufactured using the sameYIM HA-YOUNG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →