Inventor · disambiguated record
Hae-Jung Yu
Also filed as: YU HAE NAM · YU HAE-JUNG
13 granted patents·9 pending applications·100 citations·filing 2002–2024
89Inventor score
Top patents by PatentIndex Score
22 records- 0195US8779606B2Package-on-package electronic devices including sealing layers and related methods of forming the sameYIM CHOONGBIN·Filed 2013·Granted Jul 15, 2014·55 cites·18 claims
- 0292US10854551B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 1, 2020·6 cites·18 claims
- 0390US9054228B2Semiconductor packages including a heat spreader and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 9, 2015·12 cites·20 claims
- 0486US11282792B2Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy padsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 22, 2022·2 cites·20 claims
- 0586US8912048B2Method of fabricating semiconductor device including a substrate attached to a carrierSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 16, 2014·8 cites·15 claims
- 0685US8592997B2Molded underfill flip chip package preventing warpage and voidYU HAE-JUNG·Filed 2010·Granted Nov 26, 2013·12 cites·20 claims
- 0784US2025132263A1Semiconductor Package And Method Of Fabricating The SameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0880US12218070B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·19 claims
- 0977US9245867B2Package-on-package electronic devices including sealing layers and related methods of forming the sameYIM CHOONGBIN·Filed 2014·Granted Jan 26, 2016·4 cites·11 claims
- 1074US2024404984A1Semiconductor package including a molding layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1171US11637070B2Method of fabricating a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 25, 2023·0 cites·18 claims
- 1268US12080676B2Semiconductor package including a molding layerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 3, 2024·0 cites·18 claims
- 1359US9245863B2Semiconductor packaging apparatus formed from semiconductor package including first and second solder balls having different heightsSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 26, 2016·1 cites·13 claims
- 1458US2024243050A1Semiconductor package including an interposerSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1553US7923291B2Method of fabricating electronic device having stacked chipsSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Apr 12, 2011·0 cites·19 claims
- 1652US2022173044A1Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy padsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1752US2023063147A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1849US11935867B2Semiconductor package with memory stack structure connected to logic dies via an interposerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 19, 2024·0 cites·20 claims
- 1943US2008268579A1Semiconductor chip package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2043US2008258288A1Semiconductor device stack package, electronic apparatus including the same, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2142US2014239478A1Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 2234US2003232641A1Wire/wireless internet lottery system using random-number generatorFiled 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hae-Jung Yu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →