Inventor · disambiguated record
Hajime Yukutake
Also filed as: YUKUTAKE Hajime
2 granted patents·11 pending applications·0 citations·filing 2020–2025
24Inventor score
Top patents by PatentIndex Score
13 records- 0169US2025179269A1Inorganic particle dispersion resin composition and manufacturing method of inorganic particle dispersion resin compositionRESONAC CORP·Filed 2025·Application pending·0 cites
- 0266US12252600B2Inorganic particle dispersion resin composition and manufacturing method of inorganic particle dispersion resin compositionSHOWA DENKO KK·Filed 2020·Granted Mar 18, 2025·0 cites·5 claims
- 0361US2024043659A1Heat conducting compositionRESONAC CORP·Filed 2023·Application pending·0 cites
- 0459US2023399512A1Thermally conductive compositionRESONAC CORP·Filed 2023·Application pending·0 cites
- 0558US2023287213A1Thermally conductive composition, cured product and electronic componentRESONAC CORP·Filed 2023·Application pending·0 cites
- 0658US2024026055A1Surface-treated filler, method for producing surface-treated filler, and heat conducting compositionRESONAC CORP·Filed 2023·Application pending·0 cites
- 0750US2024059901A1Method for producing surface-treated thermally conductive filler, and thermally conductive compositionRESONAC CORP·Filed 2021·Application pending·0 cites
- 0849US2024101885A1Heat conducting composition and cured product thereofRESONAC CORP·Filed 2022·Application pending·0 cites
- 0949US2023313017A1Thermally conductive compositionRESONAC CORP·Filed 2023·Application pending·0 cites
- 1049US2024052224A1Thermally conductive compositionRESONAC CORP·Filed 2022·Application pending·0 cites
- 1147US12480031B2Thermally conductive resin composition, cured product, heat transfer member and electronic deviceRESONAC CORP·Filed 2022·Granted Nov 25, 2025·0 cites·9 claims
- 1242US2023227707A1Thermally conductive composition and cured product thereofSHOWA DENKO KK·Filed 2021·Application pending·0 cites
- 1342US2024052223A1Thermally conductive urethane resin composition and cured productSHOWA DENKO KK·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →