Inventor · disambiguated record
Hao-Chieh Yung
Also filed as: YUNG HAO-CHIEH
5 granted patents·121 citations·filing 1998–2000
80Inventor score
Files withWINBOND ELECTRONICS CORP5
Top patents by PatentIndex Score
5 records- 0181US6075280APrecision breaking of semiconductor wafer into chips by applying an etch processWINBOND ELECTRONICS CORP·Filed 1998·Granted Jun 13, 2000·90 cites·9 claims
- 0265US6307266B1Metal-line structure having a spacer structure covering the sidewalls thereofWINBOND ELECTRONICS CORP·Filed 2000·Granted Oct 23, 2001·13 cites·6 claims
- 0343US6660593B2Method for fabricating oxide layers with different thicknessesWINBOND ELECTRONICS CORP·Filed 2000·Granted Dec 9, 2003·3 cites·6 claims
- 0440US6034439AMethod and structure for preventing bonding pads from peeling caused by plug processWINBOND ELECTRONICS CORP·Filed 1998·Granted Mar 7, 2000·14 cites·5 claims
- 0527US6127252AMetal-line structure in integrated circuit and method of fabricating the sameWINBOND ELECTRONICS CORP·Filed 1998·Granted Oct 3, 2000·1 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →