Inventor · disambiguated record
Heui-Gyun Ahn
Also filed as: AHN HEUI GYUN
15 granted patents·6 pending applications·40 citations·filing 2004–2014
89Inventor score
Files withSILICONFILE TECH INC7SILICONFILE TECHNOLOGIES INC4JEON IN GYUN3AHN HEUI GYUN2DONGBU ELECTRONICS CO LTD2
Top patents by PatentIndex Score
21 records- 0188US9613881B2Semiconductor device having improved heat-dissipation characteristicsSILICONFILE TECH INC·Filed 2014·Granted Apr 4, 2017·14 cites·21 claims
- 0288US8421134B2Back side illumination image sensor reduced in size and method for manufacturing the sameJEON IN GYUN·Filed 2010·Granted Apr 16, 2013·7 cites·3 claims
- 0383US8193023B2Unit pixel of image sensor having three-dimensional structure and method for manufacturing the sameAHN HEUI-GYUN·Filed 2010·Granted Jun 5, 2012·9 cites·13 claims
- 0481US9406652B2Stack memorySILICONFILE TECH INC·Filed 2014·Granted Aug 2, 2016·6 cites·10 claims
- 0574US8420429B2Back side illumination image sensor reduced in size and method for manufacturing the sameJEON IN GYUN·Filed 2012·Granted Apr 16, 2013·1 cites·5 claims
- 0663US9478464B2Method for manufacturing through-hole silicon viaSILICONFILE TECH INC·Filed 2014·Granted Oct 25, 2016·1 cites·20 claims
- 0763US8816459B2Image sensor having wave guide and method for manufacturing the sameJEON IN-GYUN·Filed 2012·Granted Aug 26, 2014·0 cites·9 claims
- 0862US8399282B2Method for forming pad in wafer with three-dimensional stacking structureAHN HEUI GYUN·Filed 2011·Granted Mar 19, 2013·1 cites·16 claims
- 0960US10165169B2Image processing package and camera module having sameSK HYNIX INC·Filed 2014·Granted Dec 25, 2018·1 cites·12 claims
- 1057US8368158B2Image sensor having wave guide and method for manufacturing the sameSILICONFILE TECHNOLOGIES INC·Filed 2010·Granted Feb 5, 2013·0 cites·17 claims
- 1157US2015325618A1Cmos image sensor including color microlens, and method for manufacturing sameSILICONFILE TECHNOLOGIES INC·Filed 2013·Application pending·0 cites
- 1254US7772666B2CMOS image sensor and method for manufacturing the sameDONGBU ELECTRONICS CO LTD·Filed 2006·Granted Aug 10, 2010·0 cites·3 claims
- 1351US10313620B2Image data output device for image signal processorSK HYNIX INC·Filed 2014·Granted Jun 4, 2019·0 cites·13 claims
- 1451US8993411B2Method for forming pad in wafer with three-dimensional stacking structureSILICONFILE TECHNOLOGIES INC·Filed 2013·Granted Mar 31, 2015·0 cites·14 claims
- 1543US9543348B2Backlight image sensor chip having improved chip driving performanceSILICONFILE TECH INC·Filed 2014·Granted Jan 10, 2017·0 cites·12 claims
- 1643US2016267946A1Stack memory device and method for operating sameSILICONFILE TECH INC·Filed 2014·Application pending·0 cites
- 1742US2016268373A1Semiconductor apparatus having heat dissipating function and electronic equipment comprising sameSILICONFILE TECH INC·Filed 2014·Application pending·0 cites
- 1842US2016372512A1Method for forming pad of waferSILICONFILE TECH INC·Filed 2014·Application pending·0 cites
- 1940US7247533B2Method of fabricating semiconductor device using selective epitaxial growthDONGBU ELECTRONICS CO LTD·Filed 2004·Granted Jul 24, 2007·0 cites·12 claims
- 2040US2007077723A1Method of forming shallow trench isolation in a semiconductor deviceDONGBUANAM SEMICONDUCTOR INC·Filed 2005·Application pending·0 cites
- 2139US2015155323A1Chip-stacked image sensor having heterogeneous junction structure and method for manufacturing sameSILICONFILE TECHNOLOGIES INC·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →