Inventor · disambiguated record
Henning Braunisch
Also filed as: BRAUNISCH HENNING · GEORGE ANNA M · GEORGE LEGAL REPRESENTATIVE AN · LU DAOQIANG
119 granted patents·35 pending applications·896 citations·filing 1999–2024
99Inventor score
Top patents by PatentIndex Score
154 records- 0198US8227904B2Multi-chip package and method of providing die-to-die interconnects in sameBRAUNISCH HENNING·Filed 2009·Granted Jul 24, 2012·174 cites·3 claims
- 0296US10943851B1Reconstituted wafer assemblyINTEL CORP·Filed 2019·Granted Mar 9, 2021·18 cites·22 claims
- 0396US8188594B2Input/output package architecturesGANESAN SANKA·Filed 2009·Granted May 29, 2012·59 cites·22 claims
- 0495US12176323B2Microelectronic assembliesINTEL CORP·Filed 2022·Granted Dec 24, 2024·2 cites·12 claims
- 0595US10763216B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2019·Granted Sep 1, 2020·7 cites·19 claims
- 0695US10054737B2Optical I/O system using planar light-wave integrated circuitINTEL CORP·Filed 2016·Granted Aug 21, 2018·12 cites·25 claims
- 0794US9129817B2Magnetic core inductor (MCI) structures for integrated voltage regulatorsELSHERBINI ADEL A·Filed 2013·Granted Sep 8, 2015·24 cites·18 claims
- 0894US7344383B1Split socket optical interconnectINTEL CORP·Filed 2006·Granted Mar 18, 2008·33 cites·17 claims
- 0994US7280024B2Integrated transformer structure and method of fabricationINTEL CORP·Filed 2005·Granted Oct 9, 2007·31 cites·18 claims
- 1093US9875969B2Multi-chip package and method of providing die-to-die interconnects in sameBRAUNISCH HENNING·Filed 2012·Granted Jan 23, 2018·12 cites·6 claims
- 1193US9507086B2Optical I/O system using planar light-wave integrated circuitKOBRINSKY MAURO J·Filed 2011·Granted Nov 29, 2016·19 cites·9 claims
- 1293US7517228B2Surface mounted micro-scale springs for separable interconnection of package substrate and high-speed flex-circuitINTEL CORP·Filed 2005·Granted Apr 14, 2009·28 cites·15 claims
- 1392US7720337B2Wafer based optical interconnectINTEL CORP·Filed 2007·Granted May 18, 2010·29 cites·17 claims
- 1492US7183658B2Low cost microelectronic circuit packageINTEL CORP·Filed 2001·Granted Feb 27, 2007·84 cites·47 claims
- 1591US11133263B2High-density interconnects for integrated circuit packagesINTEL CORP·Filed 2019·Granted Sep 28, 2021·6 cites·22 claims
- 1691US10923429B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2020·Granted Feb 16, 2021·2 cites·20 claims
- 1791US10651525B2Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubsINTEL CORP·Filed 2018·Granted May 12, 2020·5 cites·11 claims
- 1891US10510669B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2018·Granted Dec 17, 2019·4 cites·7 claims
- 1990US7705447B2Input/output package architectures, and methods of using sameINTEL CORP·Filed 2008·Granted Apr 27, 2010·19 cites·35 claims
- 2090US7684660B2Methods and apparatus to mount a waveguide to a substrateINTEL CORP·Filed 2005·Granted Mar 23, 2010·34 cites·21 claims
- 2190US7646093B2Thermal management of dies on a secondary side of a packageINTEL CORP·Filed 2006·Granted Jan 12, 2010·28 cites·26 claims
- 2290US7068892B1Passively aligned optical-electrical interfaceINTEL CORP·Filed 2005·Granted Jun 27, 2006·26 cites·21 claims
- 2389US9992859B2Low loss and low cross talk transmission lines using shaped viasINTEL CORP·Filed 2015·Granted Jun 5, 2018·5 cites·4 claims
- 2489US2024429173A1Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2024·Application pending·0 cites
- 2588US6792179B2Optical thumbtackINTEL CORP·Filed 2002·Granted Sep 14, 2004·35 cites·31 claims
- 2687US10187998B2Zero-misalignment via-pad structuresINTEL CORP·Filed 2017·Granted Jan 22, 2019·4 cites·10 claims
- 2787US8450201B2Multimode signaling on decoupled input/output and power channelsBRAUNISCH HENNING·Filed 2011·Granted May 28, 2013·7 cites·9 claims
- 2886US12113026B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 2986US7989946B2Multimode signaling on decoupled input/output and power channelsINTEL CORP·Filed 2010·Granted Aug 2, 2011·6 cites·7 claims
- 3085US9713264B2Zero-misalignment via-pad structuresINTEL CORP·Filed 2014·Granted Jul 18, 2017·5 cites·11 claims
- 3184US11348897B2Microelectronic assembliesINTEL CORP·Filed 2017·Granted May 31, 2022·3 cites·7 claims
- 3284US10845552B2Coreless package architecture for multi-chip opto-electronicsINTEL CORP·Filed 2017·Granted Nov 24, 2020·4 cites·25 claims
- 3382US11824008B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2022·Granted Nov 21, 2023·0 cites·24 claims
- 3482US9250406B2Electro-optical assembly including a glass bridgeINTEL CORP·Filed 2012·Granted Feb 2, 2016·6 cites·25 claims
- 3581US7703991B2Flip-chip mountable optical connector for chip-to-chip optical interconnectabilityINTEL CORP·Filed 2005·Granted Apr 27, 2010·10 cites·7 claims
- 3681US2025070083A1Microelectronic assembliesINTEL CORP·Filed 2024·Application pending·0 cites
- 3781US2025096197A1Scalable embedded silicon bridge via pillars in lithographically defined vias, and methods of making sameINTEL CORP·Filed 2024·Application pending·0 cites
- 3880US12494443B2Substrate integrated thin film capacitors using amorphous high-k dielectricsINTEL CORP·Filed 2023·Granted Dec 9, 2025·0 cites·26 claims
- 3980US11329359B2Dielectric waveguide including a dielectric material with cavities therein surrounded by a conductive coating forming a wall for the cavitiesINTEL CORP·Filed 2018·Granted May 10, 2022·2 cites·25 claims
- 4080US9310553B2Optical connection techniques and configurationsBRAUNISCH HENNING·Filed 2011·Granted Apr 12, 2016·4 cites·13 claims
- 4180US9153547B2Integrated inductor structure and method of fabricationCRAWFORD ANKUR MOHAN·Filed 2009·Granted Oct 6, 2015·9 cites·17 claims
- 4280US2024429588A1Millimeter-wave dielectric waveguide bundle including first and second adjacent dielectric waveguides having different core and/or cladding materialsINTEL CORP·Filed 2024·Application pending·0 cites
- 4379US11716826B2Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing deviceINTEL CORP·Filed 2019·Granted Aug 1, 2023·2 cites·19 claims
- 4479US9711428B2Dual-sided die packagesINTEL CORP·Filed 2013·Granted Jul 18, 2017·4 cites·19 claims
- 4579US7236666B2On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical deviceINTEL CORP·Filed 2004·Granted Jun 26, 2007·19 cites·16 claims
- 4678US7177504B2Manufacturable connectorization process for optical chip-to-chip interconnectsINTEL CORP·Filed 2004·Granted Feb 13, 2007·18 cites·32 claims
- 4777US11804455B1Substrate integrated thin film capacitors using amorphous high-k dielectricsINTEL CORP·Filed 2022·Granted Oct 31, 2023·0 cites·25 claims
- 4877US11791528B2Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial lineINTEL CORP·Filed 2022·Granted Oct 17, 2023·0 cites·19 claims
- 4977US11393777B2Microelectronic assembliesINTEL CORP·Filed 2017·Granted Jul 19, 2022·2 cites·18 claims
- 5077US9435967B2Optical connection techniques and configurationsINTEL CORP·Filed 2016·Granted Sep 6, 2016·2 cites·13 claims
Showing the top 50 of 154 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →