Inventor · disambiguated record
Henry F. Breit
Also filed as: BREIT HENRY · BREIT HENRY F
20 granted patents·1 pending application·517 citations·filing 1981–2005
96Inventor score
Top patents by PatentIndex Score
21 records- 0176US5359224AInsulated lead frame for integrated circuits and method of manufacture thereofTEXAS INSTRUMENTS INC·Filed 1993·Granted Oct 25, 1994·54 cites·17 claims
- 0276US5055967ASubstrate for an electrical circuit system and a circuit system using that substrateTEXAS INSTRUMENTS INC·Filed 1990·Granted Oct 8, 1991·62 cites·34 claims
- 0373US4811166AHeat dissipating member for mounting a semiconductor device and electrical circuit unit incorporating the memberTEXAS INSTRUMENTS INC·Filed 1986·Granted Mar 7, 1989·54 cites·11 claims
- 0472US5050040AComposite material, a heat-dissipating member using the material in a circuit system, the circuit systemTEXAS INSTRUMENTS INC·Filed 1990·Granted Sep 17, 1991·54 cites·6 claims
- 0572US4994903ACircuit substrate and circuit using the substrateTEXAS INSTRUMENTS INC·Filed 1989·Granted Feb 19, 1991·50 cites·4 claims
- 0664US7416789B2Refractory metal substrate with improved thermal conductivitySTARCK H C INC·Filed 2004·Granted Aug 26, 2008·10 cites·33 claims
- 0763US5422788ATechnique for enhancing adhesion capability of heat spreaders in molded packagesTEXAS INSTRUMENTS INC·Filed 1994·Granted Jun 6, 1995·28 cites·24 claims
- 0862US5310520ACircuit system, a composite material for use therein, and a method of making the materialTEXAS INSTRUMENTS INC·Filed 1993·Granted May 10, 1994·30 cites·13 claims
- 0962US4894293ACircuit system, a composite metal material for use therein, and a method for making the materialTEXAS INSTRUMENTS INC·Filed 1988·Granted Jan 16, 1990·29 cites·19 claims
- 1059US5536906APackage for integrated circuitsTEXAS INSTRUMENTS INC·Filed 1993·Granted Jul 16, 1996·29 cites·8 claims
- 1158US5276423ACircuit units, substrates therefor and method of makingTEXAS INSTRUMENTS INC·Filed 1991·Granted Jan 4, 1994·26 cites·12 claims
- 1257US5653379AClad metal substrateTEXAS INSTRUMENTS INC·Filed 1995·Granted Aug 5, 1997·19 cites·8 claims
- 1351US5362680ATechnique for enhancing adhesion capability of heat spreaders in molded packagesTEXAS INSTRUMENTS INC·Filed 1992·Granted Nov 8, 1994·17 cites·19 claims
- 1446US2008102304A1Refractory Metal Substrate with Improved Thermal ConductivitySTARCK H C INC·Filed 2005·Application pending·0 cites
- 1542US5138114AHybrid/microwave enclosures and method of making sameTEXAS INSTRUMENTS INC·Filed 1990·Granted Aug 11, 1992·11 cites·16 claims
- 1641US5126511ACopper cored enclosures for hybrid circuitsTEXAS INSTRUMENTS INC·Filed 1991·Granted Jun 30, 1992·12 cites·13 claims
- 1739US5039335AComposite material for a circuit system and method of makingTEXAS INSTRUMENTS INC·Filed 1988·Granted Aug 13, 1991·10 cites·26 claims
- 1839US5036584AMethod of manufacture of copper cored enclosures for hybrid circuitsTEXAS INSTRUMENTS INC·Filed 1989·Granted Aug 6, 1991·9 cites·32 claims
- 1937US5435058AHybrid/microwave enclosures and method of making sameTEXAS INSTRUMENTS INC·Filed 1992·Granted Jul 25, 1995·7 cites·9 claims
- 2037US4384234ASpark plug with heat conducting sleeve for center electrodeTEXAS INSTRUMENTS INC·Filed 1981·Granted May 17, 1983·4 cites·12 claims
- 2131US4598473AProcess for producing reinforced structural articles and articles produced therebyTEXAS INSTRUMENTS INC·Filed 1984·Granted Jul 8, 1986·2 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →