Inventor · disambiguated record
Heiko Brunner
Also filed as: BRUNNER HEIKO
23 granted patents·13 pending applications·57 citations·filing 2003–2025
92Inventor score
Files withATOTECH DEUTSCHLAND GMBH22ATOTECH DEUTSCHLAND GMBH & CO KG4BRUNNER HEIKO2DYSTAR TEXTILFARBEN GMBH & CO2HELM AG2
Top patents by PatentIndex Score
36 records- 0191US8679316B2Aqueous, acid bath and method for the electrolytic deposition of copperBRUNNER HEIKO·Filed 2009·Granted Mar 25, 2014·23 cites·18 claims
- 0284US10767275B2Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrateATOTECH DEUTSCHLAND GMBH·Filed 2016·Granted Sep 8, 2020·2 cites·19 claims
- 0383US9322107B2Polymers having terminal amino groups and use thereof as additives for zinc and zinc alloy electrodeposition bathsBRUNNER HEIKO·Filed 2010·Granted Apr 26, 2016·5 cites·15 claims
- 0482US8961670B2Alkaline plating bath for electroless deposition of cobalt alloysATOTECH DEUTSCHLAND GMBH·Filed 2013·Granted Feb 24, 2015·3 cites·9 claims
- 0581US9909216B2Plating bath compositions for electroless plating of metals and metal alloysATOTECH DEUTSCHLAND GMBH·Filed 2015·Granted Mar 6, 2018·3 cites·19 claims
- 0681US9752244B2Galvanic nickel electroplating bath for depositing a semi-bright nickelATOTECH DEUTSCHLAND GMBH·Filed 2014·Granted Sep 5, 2017·2 cites·16 claims
- 0779US9551080B2Copper plating bath compositionATOTECH DEUTSCHLAND GMBH·Filed 2013·Granted Jan 24, 2017·8 cites·16 claims
- 0879US9175399B2Plating bath for electroless deposition of nickel layersATOTECH DEUTSCHLAND GMBH·Filed 2013·Granted Nov 3, 2015·5 cites·19 claims
- 0975US11066553B2Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositionsATOTECH DEUTSCHLAND GMBH·Filed 2016·Granted Jul 20, 2021·1 cites·21 claims
- 1075US9790607B13-(carbamoyl) pyridinium-1-YL-propane-1-sulfonates useful in electroplating bathsATOTECH DEUTSCHLAND GMBH·Filed 2017·Granted Oct 17, 2017·1 cites·2 claims
- 1168US9399824B2Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloysATOTECH DEUTSCHLAND GMBH·Filed 2013·Granted Jul 26, 2016·0 cites·14 claims
- 1268US2010326838A1Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloysATOTECH DEUTSCHLAND GMBH·Filed 2009·Application pending·0 cites
- 1361US9504161B2Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compoundSPARING CHRISTIAN·Filed 2011·Granted Nov 22, 2016·1 cites·9 claims
- 1461US8647491B2Pyrophosphate-based bath for plating of tin alloy layersHARTMANN PHILIP·Filed 2009·Granted Feb 11, 2014·0 cites·21 claims
- 1561US2025034718A1Use of an aqueous alkaline composition for the electroless deposition of a metal or metal alloy on a metal surface of a substrateATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2022·Application pending·0 cites
- 1660US2010155257A1Aqueous, alkaline, cyanide-free bath for the galvanic deposition of zinc alloy coatingsATOTECH DEUTSCHLAND GMBH·Filed 2007·Application pending·0 cites
- 1759US2010236936A1Aqueous,alkaline,cyanide-free bath for the galvanic deposition of zinc and zinc alloy coatingsATOTECH DEUTSCHLAND GMBH·Filed 2007·Application pending·0 cites
- 1857US2025262166A1Nanoparticles comprising enzalutamideHELM AG·Filed 2025·Application pending·0 cites
- 1955US10219391B2Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compoundATOTECH DEUTSCHLAND GMBH·Filed 2016·Granted Feb 26, 2019·0 cites·6 claims
- 2054US11091849B2Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloyATOTECH DEUTSCHLAND GMBH·Filed 2018·Granted Aug 17, 2021·0 cites·9 claims
- 2153US2025297398A1Method for depositing a zinc-nickel alloy on a substrate, an aqueous zinc-nickel deposition bath, a brightening agent and use thereofATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2023·Application pending·0 cites
- 2250US2022249388A1Nanoparticles comprising enzalutamideHELM AG·Filed 2020·Application pending·0 cites
- 2349US7872130B2Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper depositATOTECH DEUTSCHLAND GMBH·Filed 2003·Granted Jan 18, 2011·3 cites·12 claims
- 2447US2023220558A1An aqueous basic etching composition for the treatment of surfaces of metal substratesATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2021·Application pending·0 cites
- 2546US7786303B2Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compoundsATOTECH DEUTSCHLAND GMBH·Filed 2004·Granted Aug 31, 2010·0 cites·12 claims
- 2645US11512405B2Metal or metal alloy deposition composition and plating compoundATOTECH DEUTSCHLAND GMBH·Filed 2018·Granted Nov 29, 2022·0 cites·14 claims
- 2744US12359332B2Copper electroplating bathATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2021·Granted Jul 15, 2025·0 cites·15 claims
- 2844US10882842B2Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating bathsATOTECH DEUTSCHLAND GMBH·Filed 2018·Granted Jan 5, 2021·0 cites·15 claims
- 2944US2008282485A1Navy Blue and Black Mixtures, Method for the Production Thereof, and Their Use for Dying Material Containing Hydroxy GroupsDYSTAR TEXTILFARBEN GMBH & CO·Filed 2005·Application pending·0 cites
- 3041US2019264328A1Method for providing a multilayer coating on a surface of a substrateATOTECH DEUTSCHLAND GMBH·Filed 2017·Application pending·0 cites
- 3140US2006288500A1Novel quinoneimine sulfur dye compositions, production thereof and use for dyeing cellulosic materialDYSTAR TEXTILFARBEN GMBH & CO·Filed 2005·Application pending·0 cites
- 3239US2008245662A1Electrolytic Cell Comprising Multilayer Expanded MetalEILENBURGER ELEKTROLYSE & UMWELTTECHNIK GMBH·Filed 2005·Application pending·0 cites
- 3338US8828278B2Electroplating additive for the deposition of metal, a binary, ternary, quaternary or pentanary alloy of elements of group 11 (IB)—group 13 (IIIA)—Group 16 (VIA)VOSS TORSTEN·Filed 2009·Granted Sep 9, 2014·0 cites·18 claims
- 3433US10513780B2Plating bath composition and method for electroless plating of palladiumATOTECH DEUTSCHLAND GMBH·Filed 2016·Granted Dec 24, 2019·0 cites·14 claims
- 3532US2018340261A1Plating bath composition and method for electroless plating of palladiumATOTECH DEUTSCHLAND GMBH·Filed 2016·Application pending·0 cites
- 3631US10538850B2Electrolytic copper plating bath compositions and a method for their useATOTECH DEUTSCHLAND GMBH·Filed 2016·Granted Jan 21, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →