Inventor · disambiguated record
Hee Jae Byun
Also filed as: BYUN HEE JAE
3 granted patents·6 pending applications·0 citations·filing 2022–2024
40Inventor score
Files withSEMES CO LTD9
Top patents by PatentIndex Score
9 records- 0156US2025174482A1Transfer robot, method of operating transfer robot, and semiconductor manufacturing facilitySEMES CO LTD·Filed 2024·Application pending·0 cites
- 0255US12444977B2Wireless power apparatus for substrates treating apparatus and manufacturing method of wireless power apparatus for substrate treating apparatusSEMES CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·18 claims
- 0355US12240709B2Tower liftSEMES CO LTD·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 0455US12234107B2Apparatus and method for transferring the substrateSEMES CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·20 claims
- 0555US2025201612A1Transfer unit, and substrate processing apparatus including the sameSEMES CO LTD·Filed 2024·Application pending·0 cites
- 0654US2024203774A1Apparatus for transferring substrateSEMES CO LTD·Filed 2023·Application pending·0 cites
- 0749US2024014059A1Power supply apparatus and semiconductor manufacturing equipment, transport system including the sameSEMES CO LTD·Filed 2023·Application pending·0 cites
- 0849US2024063039A1Apparatus and method of detecting wafer edge using laser scanner, and semiconductor transfer deviceSEMES CO LTD·Filed 2023·Application pending·0 cites
- 0948US2024112938A1Method and apparatus for aligning wafer using laser scanner, semiconductor transfer deviceSEMES CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →